Handbook of multilevel metallization for integrated circuits : materials, technology, and applications / / edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr

• Pubblicazione: Park Ridge, N.J., U.S.A., : Noyes, c1993
• Descrizione fisica: 1 online resource (912 p.)
• Disciplina: 621.3815
• Soggetto topico: Integrated circuits - Design and construction; Metallizing
• Altri autori: WilsonSyd R TracyClarence J FreemanJohn L
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: ""Preface""; ""Contributors""; ""Table of Contents""; ""1 INTRODUCTION""; ""2 SILICIDES AND CONTACTS FOR ULSI""; ""3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs""; ""4 INORGANIC DIELECTRICS""; ""5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS""; ""6 PLANARIZATION TECHNIQUES""; ""7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM""; ""8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES""; ""9 MULTILEVEL METALLIZATION TEST VEHICLE""; ""10 MANUFACTURING AND ANALYTIC METHODS"" ; ""11 CHARACTERIZATION TECHNIQUES FOR VLSI MULTILEVEL METALLIZATION""""12 ELECTRONIC PACKAGING AND ITS INFLUENCES ON INTEGRATED CIRCUIT DESIGN AND PROCESSING""; ""13 FUTURE INTERCONNECT SYSTEMS""; ""INDEX""
• Titolo autorizzato: Handbook of multilevel metallization for integrated circuits
• ISBN: 0-8155-1761-0; 1-59124-364-5
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9911006673103321
• Lo trovi qui: Univ. Federico II
• Serie: Materials science and process technology series.