{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":2,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":27,"n_cols":5,"rows_kept":27,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[2,4,2,5],[3,2,3,3],[4,2,4,3],[5,2,5,3],[6,2,6,3],[7,2,7,3],[8,2,8,3],[10,2,10,3],[10,4,10,5],[11,2,11,3],[11,4,11,5],[12,2,12,3],[13,2,13,3],[15,2,15,3],[16,2,16,3],[17,2,17,3],[18,2,18,3],[20,2,20,3],[21,2,21,3],[25,2,25,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNIORUON00299504"]
[null,null,"Autore",null,"DWYER, William G."]
[null,null,"Titolo",null,"A study of John Webster's use of Renaissance natural and moral philosophy / by William G. Dwyer"]
[null,null,"Pubbl/distr/stampa",null,"Salzburg, : Institut für Anglistik und Amerikanistik, Universität Salzburg, 1973"]
[null,null,"Descrizione fisica",null,"206 p. ; 21 cm."]
[null,null,"Disciplina",null,"820"]
[null,null,"Soggetti",null,"WEBSTER JOHN"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNINA9911006673103321"]
[null,null,"Titolo",null,"Handbook of multilevel metallization for integrated circuits : materials, technology, and applications / / edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr"]
[null,null,"Pubbl/distr/stampa",null,"Park Ridge, N.J., U.S.A., : Noyes, c1993"]
[null,null,"ISBN",null,"0-8155-1761-0"]
[{"$nulls":4},"1-59124-364-5"]
[null,null,"Descrizione fisica",null,"1 online resource (912 p.)"]
[null,null,"Collana",null,"Materials science and process technology series"]
[null,null,"Disciplina",null,"621.3815"]
[null,null,"Soggetti",null,"Integrated circuits - Design and construction"]
[{"$nulls":4},"Metallizing"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"\"\"Preface\"\"; \"\"Contributors\"\"; \"\"Table of Contents\"\"; \"\"1 INTRODUCTION\"\"; \"\"2 SILICIDES AND CONTACTS FOR ULSI\"\"; \"\"3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs\"\"; \"\"4 INORGANIC DIELECTRICS\"\"; \"\"5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS\"\"; \"\"6 PLANARIZATION TECHNIQUES\"\"; \"\"7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM\"\"; \"\"8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES\"\"; \"\"9 MULTILEVEL METALLIZATION TEST VEHICLE\"\"; \"\"10 MANUFACTURING AND ANALYTIC METHODS\"\""]
[{"$nulls":4},"\"\"11 CHARACTERIZATION TECHNIQUES FOR VLSI MULTILEVEL METALLIZATION\"\"\"\"12 ELECTRONIC PACKAGING AND ITS INFLUENCES ON INTEGRATED CIRCUIT DESIGN AND PROCESSING\"\"; \"\"13 FUTURE INTERCONNECT SYSTEMS\"\"; \"\"INDEX\"\""]