LEADER 02551nam  2200553Ia 450 
001 9911006673103321
005 20200520144314.0
010   $a0-8155-1761-0
010   $a1-59124-364-5
035   $a(CKB)111056552536408
035   $a(EBL)3008681
035   $a(SSID)ssj0000072214
035   $a(PQKBManifestationID)11125411
035   $a(PQKBTitleCode)TC0000072214
035   $a(PQKBWorkID)10091640
035   $a(PQKB)11292537
035   $a(MiAaPQ)EBC3008681
035   $a(EXLCZ)99111056552536408
100   $a19930624d1993      uy         0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 00$aHandbook of multilevel metallization for integrated circuits $ematerials, technology, and applications /$fedited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr
210   $aPark Ridge, N.J., U.S.A. $cNoyes$dc1993
215   $a1 online resource (912 p.)
225 1 $aMaterials science and process technology series
300   $aDescription based upon print version of record.
311   $a0-8155-1340-2 
320   $aIncludes bibliographical references and index.
327   $a""Preface""; ""Contributors""; ""Table of Contents""; ""1 INTRODUCTION""; ""2 SILICIDES AND CONTACTS FOR ULSI""; ""3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs""; ""4 INORGANIC DIELECTRICS""; ""5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS""; ""6 PLANARIZATION TECHNIQUES""; ""7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM""; ""8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES""; ""9 MULTILEVEL METALLIZATION TEST VEHICLE""; ""10 MANUFACTURING AND ANALYTIC METHODS""
327   $a""11 CHARACTERIZATION TECHNIQUES FOR VLSI MULTILEVEL METALLIZATION""""12 ELECTRONIC PACKAGING AND ITS INFLUENCES ON INTEGRATED CIRCUIT DESIGN AND PROCESSING""; ""13 FUTURE INTERCONNECT SYSTEMS""; ""INDEX""
410  0$aMaterials science and process technology series.
606   $aIntegrated circuits$xDesign and construction
606   $aMetallizing
615  0$aIntegrated circuits$xDesign and construction.
615  0$aMetallizing.
676   $a621.3815
701   $aWilson$b Syd R$01824181
701   $aTracy$b Clarence J$01824182
701   $aFreeman$b John L$033071
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9911006673103321
996   $aHandbook of multilevel metallization for integrated circuits$94391261
997   $aUNINA