02551nam 2200553Ia 450 991100667310332120200520144314.00-8155-1761-01-59124-364-5(CKB)111056552536408(EBL)3008681(SSID)ssj0000072214(PQKBManifestationID)11125411(PQKBTitleCode)TC0000072214(PQKBWorkID)10091640(PQKB)11292537(MiAaPQ)EBC3008681(EXLCZ)9911105655253640819930624d1993 uy 0engur|n|---|||||txtccrHandbook of multilevel metallization for integrated circuits materials, technology, and applications /edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, JrPark Ridge, N.J., U.S.A. Noyesc19931 online resource (912 p.)Materials science and process technology seriesDescription based upon print version of record.0-8155-1340-2 Includes bibliographical references and index.""Preface""; ""Contributors""; ""Table of Contents""; ""1 INTRODUCTION""; ""2 SILICIDES AND CONTACTS FOR ULSI""; ""3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs""; ""4 INORGANIC DIELECTRICS""; ""5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS""; ""6 PLANARIZATION TECHNIQUES""; ""7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM""; ""8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES""; ""9 MULTILEVEL METALLIZATION TEST VEHICLE""; ""10 MANUFACTURING AND ANALYTIC METHODS""""11 CHARACTERIZATION TECHNIQUES FOR VLSI MULTILEVEL METALLIZATION""""12 ELECTRONIC PACKAGING AND ITS INFLUENCES ON INTEGRATED CIRCUIT DESIGN AND PROCESSING""; ""13 FUTURE INTERCONNECT SYSTEMS""; ""INDEX""Materials science and process technology series.Integrated circuitsDesign and constructionMetallizingIntegrated circuitsDesign and construction.Metallizing.621.3815Wilson Syd R1824181Tracy Clarence J1824182Freeman John L33071MiAaPQMiAaPQMiAaPQBOOK9911006673103321Handbook of multilevel metallization for integrated circuits4391261UNINA