Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim
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| Titolo: |
Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim
|
| Pubblicazione: | Oxford ; ; Philadelphia, : Woodhead Pub., c2011 |
| Edizione: | 1st edition |
| Descrizione fisica: | 1 online resource (353 p.) |
| Disciplina: | 621.38152 |
| Soggetto topico: | Integrated circuits - Deterioration |
| Electrodiffusion | |
| Thin films | |
| Interconnects (Integrated circuit technology) | |
| Altri autori: |
KimChoong-Un
|
| Note generali: | Description based upon print version of record. |
| Nota di bibliografia: | Includes bibliographical references and index. |
| Nota di contenuto: | Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht. |
| Sommario/riassunto: | Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includin |
| Titolo autorizzato: | Electromigration in thin films and electronic devices |
| ISBN: | 9780857093752 |
| 0857093754 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9911004740003321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |
Serie:
Woodhead Publishing Series in Electronic and Optical Materials