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1. |
Record Nr. |
UNINA990005967330403321 |
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Autore |
Esser, Josef |
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Titolo |
Grundlagen und Entwicklung der Gefahrdungs haftung : Beitrage zur Reform des Haftplichtrechts und zu seiner Wiedereinordnung in die Gedarker des allgemeinen Privatrechts |
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Pubbl/distr/stampa |
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Munchen : Beck'sche Verlagsbuchhan dlu ng, 1941 |
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Descrizione fisica |
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Disciplina |
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Locazione |
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Collocazione |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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2. |
Record Nr. |
UNINA9911004740003321 |
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Titolo |
Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim |
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Pubbl/distr/stampa |
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Oxford ; ; Philadelphia, : Woodhead Pub., c2011 |
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ISBN |
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Edizione |
[1st edition] |
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Descrizione fisica |
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1 online resource (353 p.) |
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Collana |
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Woodhead Publishing Series in Electronic and Optical Materials |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Integrated circuits - Deterioration |
Electrodiffusion |
Thin films |
Interconnects (Integrated circuit technology) |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht. |
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Sommario/riassunto |
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Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includin |
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3. |
Record Nr. |
UNINA9910140990203321 |
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Titolo |
2010 3rd International Conference on Emerging Trends in Engineering and Technology |
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Pubbl/distr/stampa |
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[Place of publication not identified], : I E E E, 2010 |
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ISBN |
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Descrizione fisica |
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1 online resource : illustrations |
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Disciplina |
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Soggetti |
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Engineering - Technological innovations |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Bibliographic Level Mode of Issuance: Monograph |
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Sommario/riassunto |
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Mobile Ad-hoc Networks (MANETs) allow wireless nodes to form a network without requiring a fixed Infrastructure Dynamic Source Routing (DSR) for mobile Ad Hoc network. It is a reactive source routing protocol for mobile IP network. Temporally-Ordered Routing Algorithm (TORA) routing protocol is for mobile ad hoc networks. It can be made to operate in both reactive and proactive modes. It uses IMEP for link status and neighbor Connectivity sensing. Internet MANET Encapsulation Protocol (IMEP) is used for link status and neighbor connectivity sensing. It is used by the TORA routing protocol. One main challenge in design of these networks is their vulnerability to security attacks. We study the threats an ad hoc network faces and the security goals to be achieved. We present and examine analytical simulation results for the routing protocols DSR and TORA network performance, using the well known network simulator OPNET 10. 0. |
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