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Record Nr. |
UNINA9911004740003321 |
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Titolo |
Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim |
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Pubbl/distr/stampa |
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Oxford ; ; Philadelphia, : Woodhead Pub., c2011 |
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ISBN |
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Edizione |
[1st edition] |
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Descrizione fisica |
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1 online resource (353 p.) |
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Collana |
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Woodhead Publishing Series in Electronic and Optical Materials |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Integrated circuits - Deterioration |
Electrodiffusion |
Thin films |
Interconnects (Integrated circuit technology) |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht. |
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Sommario/riassunto |
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Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices |
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