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[null,"1.","Record Nr.",null,"UNINA9910982892203321"]
[null,null,"Autore",null,"Merck, Emanuel"]
[null,null,"Titolo",null,"Dyeing reagents for thin layer and paper chromatography / [E. Merck]"]
[null,null,"Pubbl/distr/stampa",null,"Darmstadt, : Merck, 1974"]
[null,null,"Descrizione fisica",null,"X, 118 p. ; 21 cm"]
[null,null,"Disciplina",null,"544.92"]
[null,null,"Locazione",null,"FAGBC"]
[null,null,"Collocazione",null,"A BOT 528"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNINA9911004740003321"]
[null,null,"Titolo",null,"Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim"]
[null,null,"Pubbl/distr/stampa",null,"Oxford ; ; Philadelphia, : Woodhead Pub., c2011"]
[null,null,"ISBN",null,"9780857093752"]
[{"$nulls":4},"0857093754"]
[null,null,"Edizione",null,"[1st edition]"]
[null,null,"Descrizione fisica",null,"1 online resource (353 p.)"]
[null,null,"Collana",null,"Woodhead Publishing Series in Electronic and Optical Materials"]
[null,null,"Disciplina",null,"621.38152"]
[null,null,"Soggetti",null,"Integrated circuits - Deterioration"]
[{"$nulls":4},"Electrodiffusion"]
[{"$nulls":4},"Thin films"]
[{"$nulls":4},"Interconnects (Integrated circuit technology)"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht."]
[null,null,null,"Sommario/riassunto","Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling "]
[{"$nulls":4},"electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includin"]