03753nam 2200673 a 450 991100474000332120200520144314.097808570937520857093754(CKB)2670000000114644(EBL)1584656(OCoLC)867318358(SSID)ssj0000596223(PQKBManifestationID)12253836(PQKBTitleCode)TC0000596223(PQKBWorkID)10574426(PQKB)11241663(MiAaPQ)EBC1584656(CaSebORM)9781845699376(OCoLC)880416293(OCoLC)ocn880416293(EXLCZ)99267000000011464420110722d2011 uy 0engur|n|---|||||txtccrElectromigration in thin films and electronic devices materials and reliability /edited by Choong-Un Kim1st editionOxford ;Philadelphia Woodhead Pub.c20111 online resource (353 p.)Woodhead Publishing Series in Electronic and Optical MaterialsDescription based upon print version of record.9781613443910 1613443919 9781845699376 1845699378 Includes bibliographical references and index.Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includinWoodhead Publishing Series in Electronic and Optical MaterialsIntegrated circuitsDeteriorationElectrodiffusionThin filmsInterconnects (Integrated circuit technology)Integrated circuitsDeterioration.Electrodiffusion.Thin films.Interconnects (Integrated circuit technology)621.38152Kim Choong-Un1823913MiAaPQMiAaPQMiAaPQBOOK9911004740003321Electromigration in thin films and electronic devices4390856UNINA