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035   $a(CaSebORM)9781845699376
035   $a(OCoLC)880416293
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100   $a20110722d2011      uy         0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 00$aElectromigration in thin films and electronic devices $ematerials and reliability /$fedited by Choong-Un Kim
205   $a1st edition
210   $aOxford ;$aPhiladelphia $cWoodhead Pub.$dc2011
215   $a1 online resource (353 p.)
225 1 $aWoodhead Publishing Series in Electronic and Optical Materials
300   $aDescription based upon print version of record.
311 08$a9781613443910 
311 08$a1613443919 
311 08$a9781845699376 
311 08$a1845699378 
320   $aIncludes bibliographical references and index.
327   $aPart I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
330   $aUnderstanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includin
410  0$aWoodhead Publishing Series in Electronic and Optical Materials
606   $aIntegrated circuits$xDeterioration
606   $aElectrodiffusion
606   $aThin films
606   $aInterconnects (Integrated circuit technology)
615  0$aIntegrated circuits$xDeterioration.
615  0$aElectrodiffusion.
615  0$aThin films.
615  0$aInterconnects (Integrated circuit technology)
676   $a621.38152
701   $aKim$b Choong-Un$01823913
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9911004740003321
996   $aElectromigration in thin films and electronic devices$94390856
997   $aUNINA