2010 IEEE 14th Workshop on Signal Propagation on Interconnects

• Pubblicazione: [Place of publication not identified], : I E E E, 2010
• Descrizione fisica: 1 online resource
• Disciplina: 621.382
• Soggetto topico: Signal theory (Telecommunication)
• Persona (resp. second.): IEEE Staff
• Note generali: Bibliographic Level Mode of Issuance: Monograph
• Sommario/riassunto: The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.
• Titolo autorizzato: 2010 IEEE 14th Workshop on Signal Propagation on Interconnects
• ISBN: 9781424476107; 1424476100
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910139110203321
• Lo trovi qui: Univ. Federico II