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010   $a9781424476107
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100   $a20160829d2010      uy 
101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$a2010 IEEE 14th Workshop on Signal Propagation on Interconnects
210 31$a[Place of publication not identified]$cI E E E$d2010
215   $a1 online resource
300   $aBibliographic Level Mode of Issuance: Monograph
311 08$a9781424476114 
311 08$a1424476119 
330   $aThe paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.
606   $aSignal theory (Telecommunication)$vCongresses
615  0$aSignal theory (Telecommunication)
676   $a621.382
702   $aIEEE Staff
801  0$bPQKB
906   $aPROCEEDING
912   $a9910139110203321
996   $a2010 IEEE 14th Workshop on Signal Propagation on Interconnects$92496378
997   $aUNINA