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[null,"1.","Record Nr.",null,"UNINA9910139110203321"]
[null,null,"Titolo",null,"2010 IEEE 14th Workshop on Signal Propagation on Interconnects"]
[null,null,"Pubbl/distr/stampa",null,"[Place of publication not identified], : I E E E, 2010"]
[null,null,"ISBN",null,"9781424476107"]
[{"$nulls":4},"1424476100"]
[null,null,"Descrizione fisica",null,"1 online resource"]
[null,null,"Disciplina",null,"621.382"]
[null,null,"Soggetti",null,"Signal theory (Telecommunication)"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,null,null,"Sommario/riassunto","The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model."]