02141oam 2200433zu 450 991013911020332120241212215850.097814244761071424476100(CKB)2560000000009674(SSID)ssj0000452056(PQKBManifestationID)12194447(PQKBTitleCode)TC0000452056(PQKBWorkID)10463581(PQKB)10311414(NjHacI)992560000000009674(EXLCZ)99256000000000967420160829d2010 uy engur|||||||||||txtccr2010 IEEE 14th Workshop on Signal Propagation on Interconnects[Place of publication not identified]I E E E20101 online resourceBibliographic Level Mode of Issuance: Monograph9781424476114 1424476119 The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.Signal theory (Telecommunication)CongressesSignal theory (Telecommunication)621.382IEEE StaffPQKBPROCEEDING99101391102033212010 IEEE 14th Workshop on Signal Propagation on Interconnects2496378UNINA