Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies [[electronic resource] ] : IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 / / Kevin Bennion, Gilbert Moreno
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| Autore: |
Bennion Kevin
|
| Titolo: |
Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies [[electronic resource] ] : IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 / / Kevin Bennion, Gilbert Moreno
|
| Pubblicazione: | Golden, Colo. : , : National Renewable Energy Laboratory, , [2009] |
| Descrizione fisica: | 1 online resource (26 pages) : color illustrations |
| Soggetto topico: | Power semiconductors - Cooling |
| Power semiconductors - Packaging | |
| Altri autori: |
MorenoGilbert
|
| Note generali: | Title from PDF title screen (viewed on July 26, 2010). |
| Altri titoli varianti: | Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies |
| Titolo autorizzato: | Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910697242603321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |
Serie:
NREL/PR ; ; 540-48147.