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Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010
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Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies
ID:
3435261
Creatori:
(1386369) Bennion, Kevin
...
(1386370) Moreno, Gilbert
...
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