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100   $a20100727d2009      ua             0
101 0 $aeng
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aThermal management of power semiconductor packages--matching cooling technologies with packaging technologies$b[electronic resource] $eIMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 /$fKevin Bennion, Gilbert Moreno
210  1$aGolden, Colo. :$cNational Renewable Energy Laboratory,$d[2009]
215   $a1 online resource (26 pages) $ccolor illustrations
225 1 $aNREL/PR ;$v540-48147
300   $aTitle from PDF title screen (viewed on July 26, 2010).
410  0$aNREL/PR ;$v540-48147.
517   $aThermal management of power semiconductor packages--matching cooling technologies with packaging technologies 
606   $aPower semiconductors$xCooling
606   $aPower semiconductors$xPackaging
615  0$aPower semiconductors$xCooling.
615  0$aPower semiconductors$xPackaging.
700   $aBennion$b Kevin$01386369
701   $aMoreno$b Gilbert$01386370
712 02$aNational Renewable Energy Laboratory (U.S.)
801  0$bGPO
801  1$bGPO
906   $aBOOK
912   $a9910697242603321
996   $aThermal management of power semiconductor packages--matching cooling technologies with packaging technologies$93435261
997   $aUNINA