01662nam 2200385Ia 450 991069724260332120230902161600.0(CKB)5470000002386497(OCoLC)650248448(EXLCZ)99547000000238649720100727d2009 ua 0engtxtrdacontentcrdamediacrrdacarrierThermal management of power semiconductor packages--matching cooling technologies with packaging technologies[electronic resource] IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 /Kevin Bennion, Gilbert MorenoGolden, Colo. :National Renewable Energy Laboratory,[2009]1 online resource (26 pages) color illustrationsNREL/PR ;540-48147Title from PDF title screen (viewed on July 26, 2010).NREL/PR ;540-48147.Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies Power semiconductorsCoolingPower semiconductorsPackagingPower semiconductorsCooling.Power semiconductorsPackaging.Bennion Kevin1386369Moreno Gilbert1386370National Renewable Energy Laboratory (U.S.)GPOGPOBOOK9910697242603321Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies3435261UNINA