00954nam0-22003491i-450 99000798702040332120200603093354.00-8493-1286-8000798702FED01000798702(Aleph)000798702FED0100079870220050118d2003----km-y0itay50------baengUSy---j---001y-Insect symbiosisedited by Kostas Bourtzis, Thomas A. MillerBoca RatonCRC Pressc2003347 p.26 cmContemporary topics in entomology seriesInsettiSimbiosi595.7178223itaBourtzis,KostasMiller,Thomas A.ITUNINARICAUNIMARCBK99000798702040332160 595.717 BOUK-1 20039810FAGBCFAGBCInsect symbiosis752276UNINA01662nam 2200385Ia 450 991069724260332120230902161600.0(CKB)5470000002386497(OCoLC)650248448(EXLCZ)99547000000238649720100727d2009 ua 0engtxtrdacontentcrdamediacrrdacarrierThermal management of power semiconductor packages--matching cooling technologies with packaging technologies[electronic resource] IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 /Kevin Bennion, Gilbert MorenoGolden, Colo. :National Renewable Energy Laboratory,[2009]1 online resource (26 pages) color illustrationsNREL/PR ;540-48147Title from PDF title screen (viewed on July 26, 2010).NREL/PR ;540-48147.Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies Power semiconductorsCoolingPower semiconductorsPackagingPower semiconductorsCooling.Power semiconductorsPackaging.Bennion Kevin1386369Moreno Gilbert1386370National Renewable Energy Laboratory (U.S.)GPOGPOBOOK9910697242603321Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies3435261UNINA