Vai al contenuto principale della pagina
| Autore: |
Li Zhiqiang
|
| Titolo: |
The Source/Drain Engineering of Nanoscale Germanium-based MOS Devices / / by Zhiqiang Li
|
| Pubblicazione: | Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2016 |
| Edizione: | 1st ed. 2016. |
| Descrizione fisica: | 1 online resource (71 p.) |
| Disciplina: | 530 |
| Soggetto topico: | Semiconductors |
| Electronic circuits | |
| Nanoscience | |
| Nanostructures | |
| Solid state physics | |
| Electronic Circuits and Devices | |
| Nanoscale Science and Technology | |
| Solid State Physics | |
| Note generali: | Description based upon print version of record. |
| Nota di bibliografia: | Includes bibliographical references. |
| Nota di contenuto: | Introduction -- Ge-based Schottky barrier height modulation technology -- Metal germanide technology -- Contact resistance of Ge-based devices -- Conclusions. |
| Sommario/riassunto: | This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600℃ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10−7Ω•cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node. |
| Titolo autorizzato: | The Source ![]() |
| ISBN: | 3-662-49683-6 |
| Formato: | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910254623803321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |