Reliability Analysis of Electrotechnical Devices

• Autore: Tan Cher Ming
• Pubblicazione: Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
• Descrizione fisica: 1 online resource (174 p.)
• Soggetto topico: History of engineering & technology; Technology: general issues
• Soggetto non controllato: 3D X-ray; 3D-IC (three-dimensional integrated circuit); BGA; bias temperature-humidity reliability test; conductive anodic filament (CAF); de-penalization; deconvolution; deep space environment; elastic mechanical properties; electrochemistry based electrical model; electromagnetic interference; extreme thermal shocks; factorial design of experiment; finite element analysis; fracture failure; gamma process; GaN; genetic algorithm optimization; lifetime; lineal energy; linear energy transfer; low temperature; measurement system analysis; microdosimetry; Monte Carlo simulation; multiple-input multiple-output (MIMO); n/a; near field measurement; operational amplifier; pressureless sintered micron silver joints; prompt gamma imaging; proton therapy; quality and reliability assurance; radiation hardness; reconstruction; reliability estimation; remaining useful life; return loss; SAC305; semi-empirical capacity fading model; simulation; single event effect; single event effects; state of health; useful life distribution
• Persona (resp. second.): TanCher Ming
• Sommario/riassunto: This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.
• Titolo autorizzato: Reliability Analysis of Electrotechnical Devices
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910585945603321
• Lo trovi qui: Univ. Federico II