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Electromigration modeling at circuit layout level / / Cher Ming Tan, Feifei He
Electromigration modeling at circuit layout level / / Cher Ming Tan, Feifei He
Autore Tan Cher Ming
Edizione [1st ed. 2013.]
Pubbl/distr/stampa Singapore : , : Springer, , 2013
Descrizione fisica 1 online resource (x, 103 pages) : illustrations (chiefly color)
Disciplina 621.3815
Collana SpringerBriefs in Reliability
Soggetto topico Integrated circuits - Reliability
Electrodiffusion
ISBN 981-4451-21-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion.
Record Nr. UNINA-9910739461403321
Tan Cher Ming  
Singapore : , : Springer, , 2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Reliability Analysis of Electrotechnical Devices
Reliability Analysis of Electrotechnical Devices
Autore Tan Cher Ming
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (174 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Soggetto non controllato 3D-IC (three-dimensional integrated circuit)
electromagnetic interference
near field measurement
SAC305
BGA
low temperature
fracture failure
factorial design of experiment
genetic algorithm optimization
return loss
multiple-input multiple-output (MIMO)
single event effects
linear energy transfer
Monte Carlo simulation
radiation hardness
pressureless sintered micron silver joints
deep space environment
extreme thermal shocks
reconstruction
simulation
elastic mechanical properties
state of health
remaining useful life
electrochemistry based electrical model
semi-empirical capacity fading model
useful life distribution
quality and reliability assurance
single event effect
microdosimetry
lineal energy
deconvolution
gamma process
lifetime
measurement system analysis
reliability estimation
GaN
operational amplifier
proton therapy
prompt gamma imaging
3D X-ray
bias temperature-humidity reliability test
conductive anodic filament (CAF)
de-penalization
finite element analysis
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910585945603321
Tan Cher Ming  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui