Thermal Management for Opto-Electronics Packaging and Applications

• Autore: Luo Xiaobing
• Pubblicazione: Newark : , : John Wiley & Sons, Incorporated, , 2024; ©2024
• Edizione: 1st ed.
• Descrizione fisica: 1 online resource (370 pages)
• Soggetto topico: Electronic packaging; Heat engineering
• Altri autori: HuRun XieBin
• Nota di contenuto: Cover -- Title Page -- Copyright Page -- Contents -- List of Nomenclatures -- About the Authors -- Preface -- Chapter 1 Introduction -- 1.1 Development History of Packaging -- 1.1.1 BGA -- 1.1.2 CSP -- 1.1.3 MCM -- 1.1.4 3D Packaging -- 1.2 Heat Generation in Opto-electronic Package -- 1.2.1 Heat Generation Due to Nonradiative Recombination -- 1.2.2 Heat Generation Due to Shockley–Read–Hall (SRH) Recombination -- 1.2.3 Heat Generation Due to Auger Recombination -- 1.2.4 Heat Generation Due to Surface Recombination -- 1.2.5 Heat Generation Due to Current Crowding and Overflow -- 1.2.6 Heat Generation Due to Light Absorption -- 1.3 Thermal Issues and Challenges -- 1.3.1 Thermal Management -- 1.3.2 Mechanical/Electrical Reliability -- 1.4 Organization Arrangement -- References -- Chapter 2 Thermal Conduction and Solutions -- 2.1 Concept of Thermal Conduction -- 2.2 Thermal Resistance -- 2.2.1 Basic Concept of Thermal Resistance -- 2.2.2 Thermal Contact Resistance
• Sommario/riassunto: This book, authored by Xiaobing Luo, Run Hu, and Bin Xie, focuses on the thermal management of packaging and its applications. It delves into the development history of packaging technologies, the challenges of heat generation in electronic packages, and various thermal management solutions. Key topics include thermal conduction, convection, radiation, and the use of advanced materials such as graphene and phase-change materials. The book also explores opto-thermal modeling and the enhancement of thermal interface materials. It aims to provide comprehensive knowledge for engineers, researchers, and students in the field of thermal management in electronics.
• Titolo autorizzato: Thermal Management for Opto-Electronics Packaging and Applications
• ISBN: 9781119179283; 1119179289; 9781119179290; 1119179297
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9911019458603321
• Lo trovi qui: Univ. Federico II