01576nam2 22003131i 450 UON0044340220231205105000.32020140828g18881890 |0itac50 baitaIT||||Y |||||Ua-à, D. 4Istituto Geografico MilitareScala nel rapporto di 1 a 50.000[Firenze]Istituto Geografico Militare1888-901 c.43 x 43 su foglio 58 x 52 cmLevata nel 1888-89-90.001UON004433682001 Carta dei possedimenti italiani in AfricaIstituto geografico militare205 Scala nel rapporto di 1 a 50.000210 [Firenze]Istituto geografico militare1888-1891215 1 c. su [25] fogli43 x 43 su foglio 58 x 52 cm300 Il titolo varia in: Carta della colonia Eritrea, per le carte E3-E4;F1-F4;G1-G4;H1-H4;I1-I2;J1.D. 4ERITREACarte geograficheUONC025521FIITFirenzeUONL000052CARTE AFRICAAFRICA - CARTE GEOGRAFICHEAIstituto Geografico MilitareFirenzeUONV0607045005Istituto Geografico MilitareUONV247708650IGMIstituto Geografico Militare <Firenze>UONV222488ITSOL20240220RICASIBA - SISTEMA BIBLIOTECARIO DI ATENEOUONSIUON00443402SIBA - SISTEMA BIBLIOTECARIO DI ATENEOSI CARTE AFRICA 056 (06) SI G 6247/19 7 056 (06) BuonoUa-à, D. 41187102UNIOR03206nam 22005173 450 991101945860332120240602090312.09781119179283111917928997811191792901119179297(MiAaPQ)EBC31357617(Au-PeEL)EBL31357617(CKB)32170745900041(Exl-AI)31357617(Perlego)4430151(EXLCZ)993217074590004120240602d2024 uy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierThermal Management for Opto-Electronics Packaging and Applications1st ed.Newark :John Wiley & Sons, Incorporated,2024.©2024.1 online resource (370 pages)9781119179276 1119179270 Cover -- Title Page -- Copyright Page -- Contents -- List of Nomenclatures -- About the Authors -- Preface -- Chapter 1 Introduction -- 1.1 Development History of Packaging -- 1.1.1 BGA -- 1.1.2 CSP -- 1.1.3 MCM -- 1.1.4 3D Packaging -- 1.2 Heat Generation in Opto-electronic Package -- 1.2.1 Heat Generation Due to Nonradiative Recombination -- 1.2.2 Heat Generation Due to Shockley–Read–Hall (SRH) Recombination -- 1.2.3 Heat Generation Due to Auger Recombination -- 1.2.4 Heat Generation Due to Surface Recombination -- 1.2.5 Heat Generation Due to Current Crowding and Overflow -- 1.2.6 Heat Generation Due to Light Absorption -- 1.3 Thermal Issues and Challenges -- 1.3.1 Thermal Management -- 1.3.2 Mechanical/Electrical Reliability -- 1.4 Organization Arrangement -- References -- Chapter 2 Thermal Conduction and Solutions -- 2.1 Concept of Thermal Conduction -- 2.2 Thermal Resistance -- 2.2.1 Basic Concept of Thermal Resistance -- 2.2.2 Thermal Contact ResistanceGenerated by AI.This book, authored by Xiaobing Luo, Run Hu, and Bin Xie, focuses on the thermal management of packaging and its applications. It delves into the development history of packaging technologies, the challenges of heat generation in electronic packages, and various thermal management solutions. Key topics include thermal conduction, convection, radiation, and the use of advanced materials such as graphene and phase-change materials. The book also explores opto-thermal modeling and the enhancement of thermal interface materials. It aims to provide comprehensive knowledge for engineers, researchers, and students in the field of thermal management in electronics.Generated by AI.Electronic packagingGenerated by AIHeat engineeringGenerated by AIElectronic packagingHeat engineeringLuo Xiaobing1761564Hu Run1761565Xie Bin696064MiAaPQMiAaPQMiAaPQBOOK9911019458603321Thermal Management for Opto-Electronics Packaging and Applications4417246UNINA