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[null,"1.","Record Nr.",null,"UNINA9911019458603321"]
[null,null,"Autore",null,"Luo Xiaobing"]
[null,null,"Titolo",null,"Thermal Management for Opto-Electronics Packaging and Applications"]
[null,null,"Pubbl/distr/stampa",null,"Newark : , : John Wiley & Sons, Incorporated, , 2024"]
[{"$nulls":4},"©2024"]
[null,null,"ISBN",null,"9781119179283"]
[{"$nulls":4},"1119179289"]
[{"$nulls":4},"9781119179290"]
[{"$nulls":4},"1119179297"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (370 pages)"]
[null,null,"Soggetti",null,"Electronic packaging"]
[{"$nulls":4},"Heat engineering"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Cover -- Title Page -- Copyright Page -- Contents -- List of Nomenclatures -- About the Authors -- Preface -- Chapter 1 Introduction --   1.1 Development History of Packaging --     1.1.1 BGA --     1.1.2 CSP --     1.1.3 MCM --     1.1.4 3D Packaging --   1.2 Heat Generation in Opto-electronic Package --     1.2.1 Heat Generation Due to Nonradiative Recombination --     1.2.2 Heat Generation Due to Shockley–Read–Hall (SRH) Recombination --     1.2.3 Heat Generation Due to Auger Recombination --     1.2.4 Heat Generation Due to Surface Recombination --     1.2.5 Heat Generation Due to Current Crowding and Overflow --     1.2.6 Heat Generation Due to Light Absorption --   1.3 Thermal Issues and Challenges --     1.3.1 Thermal Management --     1.3.2 Mechanical/Electrical Reliability --   1.4 Organization Arrangement --   References -- Chapter 2 Thermal Conduction and Solutions --   2.1 Concept of Thermal Conduction --   2.2 Thermal Resistance --     2.2.1 Basic Concept of Thermal Resistance --     2.2.2 Thermal Contact Resistance"]
[null,null,null,"Sommario/riassunto","This book, authored by Xiaobing Luo, Run Hu, and Bin Xie, focuses on the thermal management of packaging and its applications. It delves into the development history of packaging technologies, the challenges of heat generation in electronic packages, and various thermal management solutions. Key topics include thermal conduction, convection, radiation, and the use of advanced materials such as "]
[{"$nulls":4},"graphene and phase-change materials. The book also explores opto-thermal modeling and the enhancement of thermal interface materials. It aims to provide comprehensive knowledge for engineers, researchers, and students in the field of thermal management in electronics."]
[null,"2.","Record Nr.",null,"UNINA9910963182203321"]
[null,null,"Titolo",null,"SBIR and the phase III challenge of commercialization : report of a symposium / / Committee on Capitalizing on Science, Technology, and Innovation--an assessment of the Small Business Innovation Research Program, Policy and Global Affairs Division, National Research Council of the National Academies ; Charles W. Wessner, editor"]
[null,null,"Pubbl/distr/stampa",null,"Washington, D.C., : National Academies Press, c2007"]
[null,null,"ISBN",null,"0-309-17910-6"]
[{"$nulls":4},"1-280-84464-7"]
[{"$nulls":4},"9786610844647"]
[{"$nulls":4},"0-309-66633-3"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"xvi, 184 p. : ill"]
[null,null,"Soggetti",null,"Small business - Research - United States"]
[{"$nulls":4},"Small business - Technological innovations"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references (p. 177-184)."]
[null,null,"Nota di contenuto",null,"Frontmatter -- Contents -- Preface -- I INTRODUCTION -- SBIR and the Phase III Challenge of Commercialization -- II PROCEEDINGS -- Opening Remarks -- Introduction -- Meeting Mission Needs -- Panel I : The SBIR Program: Different Needs, Common Challenges -- Panel II: Transitioning SBIR: What Are the Issues for Prime Contractors? -- Keynote Speech: Accelerating Innovation: The Luna Innovation Model -- Panel III: Challenges of Phase III: SBIR Award Winners -- Panel IV: Best Practice for Agency Programs: Program Executive Offices and Program Offices -- Panel V: Lessons Learned -- Concluding Remarks -- III APPENDIXES -- Appendix A: Biographies of Speakers -- Appendix B: Participants List 14 June 2005 Symposium -- Appendix C: Bibliography."]