LEADER 03206nam 22005173 450 001 9911019458603321 005 20240602090312.0 010 $a9781119179283 010 $a1119179289 010 $a9781119179290 010 $a1119179297 035 $a(MiAaPQ)EBC31357617 035 $a(Au-PeEL)EBL31357617 035 $a(CKB)32170745900041 035 $a(Exl-AI)31357617 035 $a(Perlego)4430151 035 $a(EXLCZ)9932170745900041 100 $a20240602d2024 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aThermal Management for Opto-Electronics Packaging and Applications 205 $a1st ed. 210 1$aNewark :$cJohn Wiley & Sons, Incorporated,$d2024. 210 4$dİ2024. 215 $a1 online resource (370 pages) 311 08$a9781119179276 311 08$a1119179270 327 $aCover -- Title Page -- Copyright Page -- Contents -- List of Nomenclatures -- About the Authors -- Preface -- Chapter 1 Introduction -- 1.1 Development History of Packaging -- 1.1.1 BGA -- 1.1.2 CSP -- 1.1.3 MCM -- 1.1.4 3D Packaging -- 1.2 Heat Generation in Opto-electronic Package -- 1.2.1 Heat Generation Due to Nonradiative Recombination -- 1.2.2 Heat Generation Due to Shockley?Read?Hall (SRH) Recombination -- 1.2.3 Heat Generation Due to Auger Recombination -- 1.2.4 Heat Generation Due to Surface Recombination -- 1.2.5 Heat Generation Due to Current Crowding and Overflow -- 1.2.6 Heat Generation Due to Light Absorption -- 1.3 Thermal Issues and Challenges -- 1.3.1 Thermal Management -- 1.3.2 Mechanical/Electrical Reliability -- 1.4 Organization Arrangement -- References -- Chapter 2 Thermal Conduction and Solutions -- 2.1 Concept of Thermal Conduction -- 2.2 Thermal Resistance -- 2.2.1 Basic Concept of Thermal Resistance -- 2.2.2 Thermal Contact Resistance$7Generated by AI. 330 $aThis book, authored by Xiaobing Luo, Run Hu, and Bin Xie, focuses on the thermal management of packaging and its applications. It delves into the development history of packaging technologies, the challenges of heat generation in electronic packages, and various thermal management solutions. Key topics include thermal conduction, convection, radiation, and the use of advanced materials such as graphene and phase-change materials. The book also explores opto-thermal modeling and the enhancement of thermal interface materials. It aims to provide comprehensive knowledge for engineers, researchers, and students in the field of thermal management in electronics.$7Generated by AI. 606 $aElectronic packaging$7Generated by AI 606 $aHeat engineering$7Generated by AI 615 0$aElectronic packaging 615 0$aHeat engineering 700 $aLuo$b Xiaobing$01761564 701 $aHu$b Run$01761565 701 $aXie$b Bin$0696064 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911019458603321 996 $aThermal Management for Opto-Electronics Packaging and Applications$94417246 997 $aUNINA