Materials for high-density electronic packaging and interconnection [[electronic resource] ] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
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| Titolo: |
Materials for high-density electronic packaging and interconnection [[electronic resource] ] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
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| Pubblicazione: | Washington, D.C., : National Academy Press |
| Alexandria, VA, : Available from Defense Technical Information Center, Cameron Station, 1990 | |
| Descrizione fisica: | 1 online resource (153 p.) |
| Disciplina: | 621.381/046 |
| Soggetto topico: | Electronic packaging - Materials |
| Electrical engineering - Materials | |
| Soggetto genere / forma: | Electronic books. |
| Note generali: | "NMAB-449." |
| Nota di bibliografia: | Includes bibliographical references. |
| Titolo autorizzato: | Materials for high-density electronic packaging and interconnection |
| ISBN: | 1-280-21251-9 |
| 9786610212514 | |
| 0-309-53669-3 | |
| 0-585-14395-1 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910456025003321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |