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[null,"1.","Record Nr.",null,"UNINA9910456025003321"]
[null,null,"Titolo",null,"Materials for high-density electronic packaging and interconnection [[electronic resource] ] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council"]
[null,null,"Pubbl/distr/stampa",null,"Washington, D.C., : National Academy Press"]
[{"$nulls":4},"Alexandria, VA, : Available from Defense Technical Information Center, Cameron Station, 1990"]
[null,null,"ISBN",null,"1-280-21251-9"]
[{"$nulls":4},"9786610212514"]
[{"$nulls":4},"0-309-53669-3"]
[{"$nulls":4},"0-585-14395-1"]
[null,null,"Descrizione fisica",null,"1 online resource (153 p.)"]
[null,null,"Disciplina",null,"621.381/046"]
[null,null,"Soggetti",null,"Electronic packaging - Materials"]
[{"$nulls":4},"Electrical engineering - Materials"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","\"NMAB-449.\""]
[null,null,null,"Nota di bibliografia","Includes bibliographical references."]