01984nam 2200565Ia 450 991045602500332120200520144314.01-280-21251-997866102125140-309-53669-30-585-14395-1(CKB)110986584753362(OCoLC)70773031(CaPaEBR)ebrary10060398(SSID)ssj0000198971(PQKBManifestationID)11172344(PQKBTitleCode)TC0000198971(PQKBWorkID)10184760(PQKB)10948869(MiAaPQ)EBC3376830(Au-PeEL)EBL3376830(CaPaEBR)ebr10060398(CaONFJC)MIL21251(OCoLC)923266410(EXLCZ)9911098658475336219900201d1990 uy 0engurcn|||||||||txtccrMaterials for high-density electronic packaging and interconnection[electronic resource] report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research CouncilWashington, D.C. National Academy Press ;Alexandria, VA Available from Defense Technical Information Center, Cameron Station19901 online resource (153 p.) "NMAB-449."0-309-04233-X Includes bibliographical references.Electronic packagingMaterialsElectrical engineeringMaterialsElectronic books.Electronic packagingMaterials.Electrical engineeringMaterials.621.381/046MiAaPQMiAaPQMiAaPQBOOK9910456025003321Materials for high-density electronic packaging and interconnection1991707UNINA