LEADER 01984nam  2200565Ia 450 
001 9910456025003321
005 20200520144314.0
010   $a1-280-21251-9
010   $a9786610212514
010   $a0-309-53669-3
010   $a0-585-14395-1
035   $a(CKB)110986584753362
035   $a(OCoLC)70773031
035   $a(CaPaEBR)ebrary10060398
035   $a(SSID)ssj0000198971
035   $a(PQKBManifestationID)11172344
035   $a(PQKBTitleCode)TC0000198971
035   $a(PQKBWorkID)10184760
035   $a(PQKB)10948869
035   $a(MiAaPQ)EBC3376830
035   $a(Au-PeEL)EBL3376830
035   $a(CaPaEBR)ebr10060398
035   $a(CaONFJC)MIL21251
035   $a(OCoLC)923266410
035   $a(EXLCZ)99110986584753362
100   $a19900201d1990      uy             0
101 0 $aeng
135   $aurcn|||||||||
181   $ctxt
182   $cc
183   $acr
200 10$aMaterials for high-density electronic packaging and interconnection$b[electronic resource] $ereport of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
210   $aWashington, D.C. $cNational Academy Press ;$aAlexandria, VA $cAvailable from Defense Technical Information Center, Cameron Station$d1990
215   $a1 online resource (153 p.) 
300   $a"NMAB-449."
311   $a0-309-04233-X 
320   $aIncludes bibliographical references.
606   $aElectronic packaging$xMaterials
606   $aElectrical engineering$xMaterials
608   $aElectronic books.
615  0$aElectronic packaging$xMaterials.
615  0$aElectrical engineering$xMaterials.
676   $a621.381/046
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910456025003321
996   $aMaterials for high-density electronic packaging and interconnection$91991707
997   $aUNINA