MEMS Packaging Technologies and 3D Integration

• Autore: Seok Seonho
• Pubblicazione: MDPI - Multidisciplinary Digital Publishing Institute, 2022
• Descrizione fisica: 1 online resource (210 p.)
• Soggetto topico: Biology, life sciences; Research & information: general
• Soggetto non controllato: adhesion; Au film thickness; Au-Au bonding; biocompatible packaging; capacitive micromachined ultrasound transducers (CMUT); chronic implantation; crack propagation; deflection angle; equivalent circuit model; fan-out wafer-level package; fan-out wafer-level packaging (FOWLP); FEM; finite difference time domain; finite element; finite element analysis; Finite element method (FEM); fuzzy AHP; fuzzy VIKOR; glass substrate; heterogeneous integration; implantable; inkjet printing; integrated nanostructure-multilayer reactive system; low-temperature MEMS packaging; MCDM; MEMS and IC integration; MEMS resonator; metal direct bonding; microbump; microelectromechanical systems (MEMS) packaging; microsystem integration; millimeter-wave; multilayer reactive bonding; n/a; neural interface; neural probe; Ni/Al reactive multilayer system; optical and electromagnetics simulations; packaging-on-packaging; parylene; Pd/Al reactive multilayer system; polymer packaging; redistribution layers; redundant TSV; reliability; reliability life; room-temperature bonding; S-parameters extraction; scotch tape test; self-propagating exothermic reaction; simulation; spontaneous self-ignition; stress intensity factor (SIF); surface activated bonding; surface roughness; technology evaluation; temperature coefficient; thermal sensors; thermal stress; thin film metal; TMOS sensor; ultrasonic bonding; wafer bonding; wafer sealing
• Persona (resp. second.): SeokSeonho
• Sommario/riassunto: This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
• Titolo autorizzato: MEMS Packaging Technologies and 3D Integration
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910576876203321
• Lo trovi qui: Univ. Federico II