03844nam 2201129z- 450 991057687620332120220621(CKB)5720000000008413(oapen)https://directory.doabooks.org/handle/20.500.12854/84576(oapen)doab84576(EXLCZ)99572000000000841320202206d2022 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierMEMS Packaging Technologies and 3D IntegrationMDPI - Multidisciplinary Digital Publishing Institute20221 online resource (210 p.)3-0365-4258-2 3-0365-4257-4 This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.Biology, life sciencesbicsscResearch & information: generalbicsscadhesionAu film thicknessAu-Au bondingbiocompatible packagingcapacitive micromachined ultrasound transducers (CMUT)chronic implantationcrack propagationdeflection angleequivalent circuit modelfan-out wafer-level packagefan-out wafer-level packaging (FOWLP)FEMfinite difference time domainfinite elementfinite element analysisFinite element method (FEM)fuzzy AHPfuzzy VIKORglass substrateheterogeneous integrationimplantableinkjet printingintegrated nanostructure-multilayer reactive systemlow-temperature MEMS packagingMCDMMEMS and IC integrationMEMS resonatormetal direct bondingmicrobumpmicroelectromechanical systems (MEMS) packagingmicrosystem integrationmillimeter-wavemultilayer reactive bondingn/aneural interfaceneural probeNi/Al reactive multilayer systemoptical and electromagnetics simulationspackaging-on-packagingparylenePd/Al reactive multilayer systempolymer packagingredistribution layersredundant TSVreliabilityreliability liferoom-temperature bondingS-parameters extractionscotch tape testself-propagating exothermic reactionsimulationspontaneous self-ignitionstress intensity factor (SIF)surface activated bondingsurface roughnesstechnology evaluationtemperature coefficientthermal sensorsthermal stressthin film metalTMOS sensorultrasonic bondingwafer bondingwafer sealingBiology, life sciencesResearch & information: generalSeok Seonhoedt1059307Seok SeonhoothBOOK9910576876203321MEMS Packaging Technologies and 3D Integration3035616UNINA