03807nam 2201105z- 450 991057687620332120231214132818.0(CKB)5720000000008413(oapen)https://directory.doabooks.org/handle/20.500.12854/84576(EXLCZ)99572000000000841320202206d2022 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierMEMS Packaging Technologies and 3D IntegrationMDPI - Multidisciplinary Digital Publishing Institute20221 electronic resource (210 p.)3-0365-4258-2 3-0365-4257-4 This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.Research & information: generalbicsscBiology, life sciencesbicsscheterogeneous integrationwafer bondingwafer sealingroom-temperature bondingAu-Au bondingsurface activated bondingAu film thicknesssurface roughnessmicroelectromechanical systems (MEMS) packaginginkjet printingredistribution layerscapacitive micromachined ultrasound transducers (CMUT)fan-out wafer-level packaging (FOWLP)adhesionthin film metalparyleneneural probescotch tape testFEMMEMS resonatortemperature coefficientthermal stressmillimeter-waveredundant TSVequivalent circuit modelS-parameters extractiontechnology evaluationMEMS and IC integrationMCDMfuzzy AHPfuzzy VIKORfan-out wafer-level packagefinite elementglass substratereliability lifepackaging-on-packagingthermal sensorsTMOS sensorfinite difference time domainoptical and electromagnetics simulationsfinite element analysisultrasonic bondingmetal direct bondingmicrosystem integrationbiocompatible packagingimplantablereliabilityFinite element method (FEM)simulationmultilayer reactive bondingintegrated nanostructure-multilayer reactive systemspontaneous self-ignitionself-propagating exothermic reactionPd/Al reactive multilayer systemNi/Al reactive multilayer systemlow-temperature MEMS packagingcrack propagationmicrobumpdeflection anglestress intensity factor (SIF)polymer packagingneural interfacechronic implantationResearch & information: generalBiology, life sciencesSeok Seonhoedt1059307Seok SeonhoothBOOK9910576876203321MEMS Packaging Technologies and 3D Integration3035616UNINA