01866cam0-22003731i-450-99000786468040332120090311104846.088-85010-70-9000786468FED01000786468(Aleph)000786468FED0100078646820090311d2003----km-y0itay50------baengITy---n---101yyHumanitarian action and State sovereigntyinternational congress in the occasion of its 30. anniversary, San Remo, 31 August - 2 September 2000Refugees: a continuing challenge, 25. round table on current problems of international humanitarian law within the global consultations on international protection of refugees launched by the United Nations high commissioner for refugees, San Remo, 6-8 September 2001proceedingsedited by Stefania Baldini, Guido Ravasi[Milano]Dragan European FoundationNagard[2003]205 p.24 cmIn testa al front.: International institute of humanitarian law = Institut international de droit humanitaire = Istituto internazionale di diritto umanitarioDiritti dell'uomoConvenzioni internazionali341.48121itaRavasi,GuidoBaldini,StefaniaITUNINARICAUNIMARCBK990007864680403321H 300s.i.DSIIX H 5241106FSPBCDSIFSPBCHumanitarian action and State sovereignty673517Refugees: a continuing challenge, 25. round table on current problems of international humanitarian law within the global consultations on international protection of refugees launched by the United Nations high commissioner for refugees, San Remo, 6-8 September 2001673518UNINA03844nam 2201129z- 450 991057687620332120220621(CKB)5720000000008413(oapen)https://directory.doabooks.org/handle/20.500.12854/84576(oapen)doab84576(EXLCZ)99572000000000841320202206d2022 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierMEMS Packaging Technologies and 3D IntegrationMDPI - Multidisciplinary Digital Publishing Institute20221 online resource (210 p.)3-0365-4258-2 3-0365-4257-4 This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.Biology, life sciencesbicsscResearch & information: generalbicsscadhesionAu film thicknessAu-Au bondingbiocompatible packagingcapacitive micromachined ultrasound transducers (CMUT)chronic implantationcrack propagationdeflection angleequivalent circuit modelfan-out wafer-level packagefan-out wafer-level packaging (FOWLP)FEMfinite difference time domainfinite elementfinite element analysisFinite element method (FEM)fuzzy AHPfuzzy VIKORglass substrateheterogeneous integrationimplantableinkjet printingintegrated nanostructure-multilayer reactive systemlow-temperature MEMS packagingMCDMMEMS and IC integrationMEMS resonatormetal direct bondingmicrobumpmicroelectromechanical systems (MEMS) packagingmicrosystem integrationmillimeter-wavemultilayer reactive bondingn/aneural interfaceneural probeNi/Al reactive multilayer systemoptical and electromagnetics simulationspackaging-on-packagingparylenePd/Al reactive multilayer systempolymer packagingredistribution layersredundant TSVreliabilityreliability liferoom-temperature bondingS-parameters extractionscotch tape testself-propagating exothermic reactionsimulationspontaneous self-ignitionstress intensity factor (SIF)surface activated bondingsurface roughnesstechnology evaluationtemperature coefficientthermal sensorsthermal stressthin film metalTMOS sensorultrasonic bondingwafer bondingwafer sealingBiology, life sciencesResearch & information: generalSeok Seonhoedt1059307Seok SeonhoothBOOK9910576876203321MEMS Packaging Technologies and 3D Integration3035616UNINA