MEMS Packaging Technologies and 3D Integration

• Record Nr.: UNINA9910576876203321
• Autore: Seok Seonho
• Pubbl/distr/stampa: MDPI - Multidisciplinary Digital Publishing Institute, 2022
• Descrizione fisica: 1 electronic resource (210 p.)
• Soggetti: Research & information: general; Biology, life sciences
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Sommario/riassunto: This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.