LEADER 03807nam 2201105z- 450 001 9910576876203321 005 20231214132818.0 035 $a(CKB)5720000000008413 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/84576 035 $a(EXLCZ)995720000000008413 100 $a20202206d2022 |y 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aMEMS Packaging Technologies and 3D Integration 210 $cMDPI - Multidisciplinary Digital Publishing Institute$d2022 215 $a1 electronic resource (210 p.) 311 $a3-0365-4258-2 311 $a3-0365-4257-4 330 $aThis Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. 606 $aResearch & information: general$2bicssc 606 $aBiology, life sciences$2bicssc 610 $aheterogeneous integration 610 $awafer bonding 610 $awafer sealing 610 $aroom-temperature bonding 610 $aAu-Au bonding 610 $asurface activated bonding 610 $aAu film thickness 610 $asurface roughness 610 $amicroelectromechanical systems (MEMS) packaging 610 $ainkjet printing 610 $aredistribution layers 610 $acapacitive micromachined ultrasound transducers (CMUT) 610 $afan-out wafer-level packaging (FOWLP) 610 $aadhesion 610 $athin film metal 610 $aparylene 610 $aneural probe 610 $ascotch tape test 610 $aFEM 610 $aMEMS resonator 610 $atemperature coefficient 610 $athermal stress 610 $amillimeter-wave 610 $aredundant TSV 610 $aequivalent circuit model 610 $aS-parameters extraction 610 $atechnology evaluation 610 $aMEMS and IC integration 610 $aMCDM 610 $afuzzy AHP 610 $afuzzy VIKOR 610 $afan-out wafer-level package 610 $afinite element 610 $aglass substrate 610 $areliability life 610 $apackaging-on-packaging 610 $athermal sensors 610 $aTMOS sensor 610 $afinite difference time domain 610 $aoptical and electromagnetics simulations 610 $afinite element analysis 610 $aultrasonic bonding 610 $ametal direct bonding 610 $amicrosystem integration 610 $abiocompatible packaging 610 $aimplantable 610 $areliability 610 $aFinite element method (FEM) 610 $asimulation 610 $amultilayer reactive bonding 610 $aintegrated nanostructure-multilayer reactive system 610 $aspontaneous self-ignition 610 $aself-propagating exothermic reaction 610 $aPd/Al reactive multilayer system 610 $aNi/Al reactive multilayer system 610 $alow-temperature MEMS packaging 610 $acrack propagation 610 $amicrobump 610 $adeflection angle 610 $astress intensity factor (SIF) 610 $apolymer packaging 610 $aneural interface 610 $achronic implantation 615 7$aResearch & information: general 615 7$aBiology, life sciences 700 $aSeok$b Seonho$4edt$01059307 702 $aSeok$b Seonho$4oth 906 $aBOOK 912 $a9910576876203321 996 $aMEMS Packaging Technologies and 3D Integration$93035616 997 $aUNINA