LEADER 00946nam0-2200301---450- 001 990009378100403321 005 20110615091053.0 035 $a000937810 035 $aFED01000937810 035 $a(Aleph)000937810FED01 035 $a000937810 100 $a20110615d1911----km-y0itay50------ba 101 0 $aita 102 $aIT 105 $a--------001yy 200 1 $aSull'ematopoiesi dal punto di vista delle piu recenti osservazioni$ericerche critiche e sperimentali$fErrico Ciaramelli 210 $aNapoli$cStab. Poligrafico Napoletano$d1911 215 $ax, 351 p.$cill., 4 tav.$d24 cm 610 0 $aEmatologia$aEmopoièsi 676 $a616.15 700 1$aCiaramelli,$bErrico$0511456 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990009378100403321 952 $aIIId C 98$b1809$fDMVSF 959 $aDMVSF 996 $aSull'ematopoiesi dal punto di vista delle piu recenti osservazioni$9763265 997 $aUNINA LEADER 02694nam 22004573 450 001 9910904078703321 005 20251116153506.0 010 $a9783748940913 010 $a3748940912 035 $a(MiAaPQ)EBC31750384 035 $a(Au-PeEL)EBL31750384 035 $a(CKB)36493708500041 035 $a(OCoLC)1472995798 035 $a(oapen)147023 035 $a(EXLCZ)9936493708500041 100 $a20241105d2024 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 14$aThe New Shapes of Digital Vulnerability in European Private Law $ePrefaces by Frank Pasquale and Oreste Pollicino 205 $a1st ed. 210 $aBaden-Baden$cNomos Verlagsgesellschaft mbH & Co. KG$d2024 210 1$aBaden-Baden :$cNomos Verlagsgesellschaft,$d2024. 210 4$d©2024. 215 $a1 online resource (536 pages) 311 08$a9783756016327 311 08$a3756016323 330 $aThis book provides an analysis on whether and how the current European legal framework adequately deals with personal conditions in which digital technologies might prove particularly disruptive. It furthermore assesses how the existing policies and rules could be reinterpreted, reimagined and reshaped. In doing so, it offers a remarkable symbiosis between policy-oriented legal academic work, and more theoretical and philosophical scholarship. In particular, this book provides a more concrete meaning to the fluid concept of digital vulnerability, clarifying how this emerging paradigm may be applied both on a descriptive and prescriptive level; Identifies effective measures/remedies to ensure the utmost protection of those who may be digitally vulnerable against emerging technological threats; Helps to reconsider traditional private law micro- and macro-categories revolving around the notion of digital vulnerability, challenging traditional legal taxonomies. With contributions by Prof. Dr. Mateja Durovic | Prof. Dr. Fabrizio Esposito | Prof. Dr. Catalina Goanta | Prof. Dr. Giovanni de Gregorio | Prof. Dr. Eleni Kaprou | Prof. Dr. Emilia MisÌŒcÌenicÌ | Prof. Dr. Frank Pasquale | Prof. Dr. Oreste Pollicino | Prof. Dr. Jerry Spanakis 606 $aPrivate international law and conflict of laws$2bicssc 615 7$aPrivate international law and conflict of laws 700 $aCrea$b Camilla$0479824 701 $aDe Franceschi$b Alberto$0480134 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910904078703321 996 $aThe New Shapes of Digital Vulnerability in European Private Law$94521216 997 $aUNINA LEADER 03981nam 2201165z- 450 001 9910576876203321 005 20220621 035 $a(CKB)5720000000008413 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/84576 035 $a(oapen)doab84576 035 $a(oapen)84576 035 $a(EXLCZ)995720000000008413 100 $a20202206d2022 |y 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aMEMS Packaging Technologies and 3D Integration 210 $cMDPI - Multidisciplinary Digital Publishing Institute$d2022 215 $a1 online resource (210 p.) 311 08$a3-0365-4258-2 311 08$a3-0365-4257-4 330 $aThis Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. 606 $aBiology, life sciences$2bicssc 606 $aResearch & information: general$2bicssc 606 $aResearch and information: general$2bicssc 610 $aadhesion 610 $aAu film thickness 610 $aAu-Au bonding 610 $abiocompatible packaging 610 $acapacitive micromachined ultrasound transducers (CMUT) 610 $achronic implantation 610 $acrack propagation 610 $adeflection angle 610 $aequivalent circuit model 610 $afan-out wafer-level package 610 $afan-out wafer-level packaging (FOWLP) 610 $aFEM 610 $afinite difference time domain 610 $afinite element 610 $afinite element analysis 610 $aFinite element method (FEM) 610 $afuzzy AHP 610 $afuzzy VIKOR 610 $aglass substrate 610 $aheterogeneous integration 610 $aimplantable 610 $ainkjet printing 610 $aintegrated nanostructure-multilayer reactive system 610 $alow-temperature MEMS packaging 610 $aMCDM 610 $aMEMS and IC integration 610 $aMEMS resonator 610 $ametal direct bonding 610 $amicrobump 610 $amicroelectromechanical systems (MEMS) packaging 610 $amicrosystem integration 610 $amillimeter-wave 610 $amultilayer reactive bonding 610 $an/a 610 $aneural interface 610 $aneural probe 610 $aNi/Al reactive multilayer system 610 $aoptical and electromagnetics simulations 610 $apackaging-on-packaging 610 $aparylene 610 $aPd/Al reactive multilayer system 610 $apolymer packaging 610 $aredistribution layers 610 $aredundant TSV 610 $areliability 610 $areliability life 610 $aroom-temperature bonding 610 $aS-parameters extraction 610 $ascotch tape test 610 $aself-propagating exothermic reaction 610 $asimulation 610 $aspontaneous self-ignition 610 $astress intensity factor (SIF) 610 $asurface activated bonding 610 $asurface roughness 610 $atechnology evaluation 610 $atemperature coefficient 610 $athermal sensors 610 $athermal stress 610 $athin film metal 610 $aTMOS sensor 610 $aultrasonic bonding 610 $awafer bonding 610 $awafer sealing 615 7$aBiology, life sciences 615 7$aResearch & information: general 615 7$aResearch and information: general 700 $aSeok$b Seonho$4edt$01059307 702 $aSeok$b Seonho$4oth 906 $aBOOK 912 $a9910576876203321 996 $aMEMS Packaging Technologies and 3D Integration$93035616 997 $aUNINA