Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : 27-30 May 1998, Seattle, WA, USA / / Institute of Electrical and Electronics Engineers
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| Titolo: |
Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : 27-30 May 1998, Seattle, WA, USA / / Institute of Electrical and Electronics Engineers
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| Pubblicazione: | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 1998 |
| Descrizione fisica: | 1 online resource (170 pages) |
| Disciplina: | 621.381 |
| Soggetto topico: | Electronic apparatus and appliances - Thermal properties |
| Heat sinks (Electronics) | |
| Ball grid array technology | |
| Note generali: | Bibliographic Level Mode of Issuance: Monograph |
| Titolo autorizzato: | Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 996212595903316 |
| Lo trovi qui: | Univ. di Salerno |
| Opac: | Controlla la disponibilità qui |