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200 10$aSixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems $e27-30 May 1998, Seattle, WA, USA /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d1998.
215   $a1 online resource (170 pages)
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-4475-8 
606   $aElectronic apparatus and appliances$xThermal properties$vCongresses
606   $aHeat sinks (Electronics)$vCongresses
606   $aBall grid array technology$vCongresses
615  0$aElectronic apparatus and appliances$xThermal properties
615  0$aHeat sinks (Electronics)
615  0$aBall grid array technology
676   $a621.381
712 02$aInstitute of Electrical and Electronics Engineers,
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996   $aSixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems$92497577
997   $aUNISA