01677nam 2200445 450 99621259590331620230421041133.0(CKB)111026746721728(SSID)ssj0000454996(PQKBManifestationID)12194231(PQKBTitleCode)TC0000454996(PQKBWorkID)10398202(PQKB)10444752(WaSeSS)IndRDA00123695(EXLCZ)9911102674672172820200525d1998 uy 0engur|||||||||||txtccrSixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 27-30 May 1998, Seattle, WA, USA /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,1998.1 online resource (170 pages)Bibliographic Level Mode of Issuance: Monograph0-7803-4475-8 Electronic apparatus and appliancesThermal propertiesCongressesHeat sinks (Electronics)CongressesBall grid array technologyCongressesElectronic apparatus and appliancesThermal propertiesHeat sinks (Electronics)Ball grid array technology621.381Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING996212595903316Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2497577UNISA