| |
|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNISA996212595903316 |
|
|
Titolo |
Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : 27-30 May 1998, Seattle, WA, USA / / Institute of Electrical and Electronics Engineers |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 1998 |
|
|
|
|
|
|
|
|
|
Descrizione fisica |
|
1 online resource (170 pages) |
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
Electronic apparatus and appliances - Thermal properties |
Heat sinks (Electronics) |
Ball grid array technology |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Bibliographic Level Mode of Issuance: Monograph |
|
|
|
|
|
| |