ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International

• Pubblicazione: Materials Park, Ohio, : ASM International, 2011
• Descrizione fisica: 1 online resource (478 p.)
• Soggetto topico: Electronics - Materials - Testing; Electronic apparatus and appliances - Testing
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: ""Title Page""; ""Copyright""; ""Contents""; ""IPFA 2011 Best Paper""; ""Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation""; ""Session 1: Emerging FA Techniques and Concepts""; ""A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response""; ""Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing""; ""Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology"" ; ""Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy""""Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror""; ""Session 2: Circuit Edit""; ""The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors""; ""State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance""; ""Neon Ion Microscope Nanomachining Considerations"" ; ""Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods""""Circuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes""; ""Session 3: Packaging and Assembly Level FA I""; ""3DIC Fault Isolation Using the OBIRCH Approach""; ""Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds""; ""Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology"" ; ""Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography""""Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique""; ""Session 4: Test and Diagnostics""; ""Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis""; ""Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis""; ""Debugging an Invisible Flaky Scan Chain Defect""; ""Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree""; ""Session 5: Defect Characterization and Metrology"" ; ""A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques""""Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe""; ""Whisker Formation in Copper Electroplating""; ""Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study""; ""Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding""; ""Transmission Electron Microscopy Characterization of FinFET â€? Understanding the 3D Structure by 2D Imaging Technique"" ; ""Session 6: Photon Based Fault Isolation Techniques""
• Titolo autorizzato: ISTFA 2011
• ISBN: 1-68015-511-3; 1-61503-850-7
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910789968203321
• Lo trovi qui: Univ. Federico II