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Record Nr. |
UNINA9910789968203321 |
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Titolo |
ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International |
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Pubbl/distr/stampa |
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Materials Park, Ohio, : ASM International, 2011 |
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ISBN |
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1-68015-511-3 |
1-61503-850-7 |
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Descrizione fisica |
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1 online resource (478 p.) |
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Soggetti |
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Electronics - Materials - Testing |
Electronic apparatus and appliances - Testing |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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""Title Page""; ""Copyright""; ""Contents""; ""IPFA 2011 Best Paper""; ""Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation""; ""Session 1: Emerging FA Techniques and Concepts""; ""A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response""; ""Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing""; ""Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology"" |
""Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy""""Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror""; ""Session 2: Circuit Edit""; ""The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors""; ""State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance""; ""Neon Ion Microscope Nanomachining Considerations"" |
""Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods""""Circuit Edit and Optical Probe Development and Validation for Next Generation Process |
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Nodes""; ""Session 3: Packaging and Assembly Level FA I""; ""3DIC Fault Isolation Using the OBIRCH Approach""; ""Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds""; ""Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology"" |
""Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography""""Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique""; ""Session 4: Test and Diagnostics""; ""Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis""; ""Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis""; ""Debugging an Invisible Flaky Scan Chain Defect""; ""Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree""; ""Session 5: Defect Characterization and Metrology"" |
""A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques""""Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe""; ""Whisker Formation in Copper Electroplating""; ""Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study""; ""Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding""; ""Transmission Electron Microscopy Characterization of FinFET � Understanding the 3D Structure by 2D Imaging Technique"" |
""Session 6: Photon Based Fault Isolation Techniques"" |
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