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[null,"1.","Record Nr.",null,"UNINA9910789968203321"]
[null,null,"Titolo",null,"ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International"]
[null,null,"Pubbl/distr/stampa",null,"Materials Park, Ohio, : ASM International, 2011"]
[null,null,"ISBN",null,"1-68015-511-3"]
[{"$nulls":4},"1-61503-850-7"]
[null,null,"Descrizione fisica",null,"1 online resource (478 p.)"]
[null,null,"Soggetti",null,"Electronics - Materials - Testing"]
[{"$nulls":4},"Electronic apparatus and appliances - Testing"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"\"\"Title Page\"\"; \"\"Copyright\"\"; \"\"Contents\"\"; \"\"IPFA 2011 Best Paper\"\"; \"\"Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation\"\"; \"\"Session 1: Emerging FA Techniques and Concepts\"\"; \"\"A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response\"\"; \"\"Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing\"\"; \"\"Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology\"\""]
[{"$nulls":4},"\"\"Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy\"\"\"\"Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror\"\"; \"\"Session 2: Circuit Edit\"\"; \"\"The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors\"\"; \"\"State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance\"\"; \"\"Neon Ion Microscope Nanomachining Considerations\"\""]
[{"$nulls":4},"\"\"Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods\"\"\"\"Circuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes\"\"; \"\"Session 3: Packaging and Assembly Level FA I\"\"; \"\"3DIC Fault Isolation Using the OBIRCH Approach\"\"; \"\"Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold "]
[{"$nulls":4},"Compounds\"\"; \"\"Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology\"\""]
[{"$nulls":4},"\"\"Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography\"\"\"\"Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique\"\"; \"\"Session 4: Test and Diagnostics\"\"; \"\"Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis\"\"; \"\"Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis\"\"; \"\"Debugging an Invisible Flaky Scan Chain Defect\"\"; \"\"Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree\"\"; \"\"Session 5: Defect Characterization and Metrology\"\""]
[{"$nulls":4},"\"\"A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques\"\"\"\"Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe\"\"; \"\"Whisker Formation in Copper Electroplating\"\"; \"\"Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study\"\"; \"\"Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding\"\"; \"\"Transmission Electron Microscopy Characterization of FinFET â€? Understanding the 3D Structure by 2D Imaging Technique\"\""]
[{"$nulls":4},"\"\"Session 6: Photon Based Fault Isolation Techniques\"\""]