LEADER 04744nam  2200589 a 450 
001 9910789968203321
005 20230725032925.0
010   $a1-68015-511-3
010   $a1-61503-850-7
035   $a(CKB)2670000000160175
035   $a(EBL)3002459
035   $a(SSID)ssj0000815825
035   $a(PQKBManifestationID)11428314
035   $a(PQKBTitleCode)TC0000815825
035   $a(PQKBWorkID)10806214
035   $a(PQKB)10305123
035   $a(MiAaPQ)EBC3002459
035   $a(Au-PeEL)EBL3002459
035   $a(CaPaEBR)ebr10540844
035   $a(OCoLC)929147929
035   $a(EXLCZ)992670000000160175
100   $a20120330d2011      uy             0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 10$aISTFA 2011$b[electronic resource] $econference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA /$fsponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International
210   $aMaterials Park, Ohio $cASM International$d2011
215   $a1 online resource (478 p.)
300   $aDescription based upon print version of record.
311   $a1-61503-826-4 
320   $aIncludes bibliographical references and index.
327   $a""Title Page""; ""Copyright""; ""Contents""; ""IPFA 2011 Best Paper""; ""Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation""; ""Session 1: Emerging FA Techniques and Concepts""; ""A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response""; ""Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing""; ""Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology""
327   $a""Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy""""Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror""; ""Session 2: Circuit Edit""; ""The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors""; ""State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance""; ""Neon Ion Microscope Nanomachining Considerations""
327   $a""Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods""""Circuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes""; ""Session 3: Packaging and Assembly Level FA I""; ""3DIC Fault Isolation Using the OBIRCH Approach""; ""Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds""; ""Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology""
327   $a""Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography""""Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique""; ""Session 4: Test and Diagnostics""; ""Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis""; ""Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis""; ""Debugging an Invisible Flaky Scan Chain Defect""; ""Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree""; ""Session 5: Defect Characterization and Metrology""
327   $a""A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques""""Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe""; ""Whisker Formation in Copper Electroplating""; ""Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study""; ""Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding""; ""Transmission Electron Microscopy Characterization of FinFET a??? Understanding the 3D Structure by 2D Imaging Technique""
327   $a""Session 6: Photon Based Fault Isolation Techniques""
606   $aElectronics$xMaterials$xTesting$vCongresses
606   $aElectronic apparatus and appliances$xTesting$vCongresses
615  0$aElectronics$xMaterials$xTesting
615  0$aElectronic apparatus and appliances$xTesting
712 02$aASM International.
712 02$aElectronic Device Failure Analysis Society.
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910789968203321
996   $aISTFA 2011$93735900
997   $aUNINA