Reliability Analysis of Electrotechnical Devices

• Autore: Tan Cher Ming
• Pubblicazione: Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
• Descrizione fisica: 1 electronic resource (174 p.)
• Soggetto topico: Technology: general issues; History of engineering & technology
• Soggetto non controllato: 3D-IC (three-dimensional integrated circuit); electromagnetic interference; near field measurement; SAC305; BGA; low temperature; fracture failure; factorial design of experiment; genetic algorithm optimization; return loss; multiple-input multiple-output (MIMO); single event effects; linear energy transfer; Monte Carlo simulation; radiation hardness; pressureless sintered micron silver joints; deep space environment; extreme thermal shocks; reconstruction; simulation; elastic mechanical properties; state of health; remaining useful life; electrochemistry based electrical model; semi-empirical capacity fading model; useful life distribution; quality and reliability assurance; single event effect; microdosimetry; lineal energy; deconvolution; gamma process; lifetime; measurement system analysis; reliability estimation; GaN; operational amplifier; proton therapy; prompt gamma imaging; 3D X-ray; bias temperature-humidity reliability test; conductive anodic filament (CAF); de-penalization; finite element analysis
• Persona (resp. second.): TanCher Ming
• Sommario/riassunto: This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.
• Titolo autorizzato: Reliability Analysis of Electrotechnical Devices
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910585945603321
• Lo trovi qui: Univ. Federico II