Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability / / edited by Kim S. Siow

• Pubblicazione: Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019
• Edizione: 1st ed. 2019.
• Descrizione fisica: 1 online resource (XX, 279 p. 175 illus., 122 illus. in color.)
• Disciplina: 620.11295; 620.11297
• Soggetto topico: Optical materials; Electronic materials; Electronics; Microelectronics; Metals; Materials science; Engineering—Materials; Quality control; Reliability; Industrial safety; Optical and Electronic Materials; Electronics and Microelectronics, Instrumentation; Metallic Materials; Characterization and Evaluation of Materials; Materials Engineering; Quality Control, Reliability, Safety and Risk
• Persona (resp. second.): SiowKim S
• Nota di contenuto: Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.
• Sommario/riassunto: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
• Titolo autorizzato: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
• ISBN: 3-319-99256-2
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910337937203321
• Lo trovi qui: Univ. Federico II