05097nam 22007575 450 991033793720332120200630203452.03-319-99256-210.1007/978-3-319-99256-3(CKB)4100000007592131(DE-He213)978-3-319-99256-3(MiAaPQ)EBC5702841(PPN)233801618(EXLCZ)99410000000759213120190129d2019 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrierDie-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /edited by Kim S. Siow1st ed. 2019.Cham :Springer International Publishing :Imprint: Springer,2019.1 online resource (XX, 279 p. 175 illus., 122 illus. in color.) 3-319-99255-4 Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.Optical materialsElectronicsMaterialsElectronicsMicroelectronicsMetalsMaterials scienceEngineering—MaterialsQuality controlReliabilityIndustrial safetyOptical and Electronic Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z12000Electronics and Microelectronics, Instrumentationhttps://scigraph.springernature.com/ontologies/product-market-codes/T24027Metallic Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z16000Characterization and Evaluation of Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z17000Materials Engineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/T28000Quality Control, Reliability, Safety and Riskhttps://scigraph.springernature.com/ontologies/product-market-codes/T22032Optical materials.ElectronicsMaterials.Electronics.Microelectronics.Metals.Materials science.Engineering—Materials.Quality control.Reliability.Industrial safety.Optical and Electronic Materials.Electronics and Microelectronics, Instrumentation.Metallic Materials.Characterization and Evaluation of Materials.Materials Engineering.Quality Control, Reliability, Safety and Risk.620.11295620.11297Siow Kim Sedthttp://id.loc.gov/vocabulary/relators/edtBOOK9910337937203321Die-Attach Materials for High Temperature Applications in Microelectronics Packaging1570050UNINA