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1. |
Record Nr. |
UNINA9910464929003321 |
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Autore |
Selmés Jacques |
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Titolo |
La maladie d'Alzheimer : cahier d'activités 3 : activités de réminiscence : 20 situations pour faire revivre son passé à votre proche / / Jacques Selmés |
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Pubbl/distr/stampa |
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Montrouge, France : , : John Libbey Eurotext, , 2010 |
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©2010 |
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ISBN |
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Descrizione fisica |
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1 online resource (50 p.) |
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Collana |
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Guides Pratiques De L'Aidant |
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Disciplina |
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Soggetti |
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Alzheimer's disease |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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2. |
Record Nr. |
UNINA9910337937203321 |
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Titolo |
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability / / edited by Kim S. Siow |
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Pubbl/distr/stampa |
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Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
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ISBN |
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Edizione |
[1st ed. 2019.] |
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Descrizione fisica |
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1 online resource (XX, 279 p. 175 illus., 122 illus. in color.) |
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Disciplina |
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Soggetti |
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Optical materials |
Electronics - Materials |
Electronics |
Microelectronics |
Metals |
Materials science |
Engineering—Materials |
Quality control |
Reliability |
Industrial safety |
Optical and Electronic Materials |
Electronics and Microelectronics, Instrumentation |
Metallic Materials |
Characterization and Evaluation of Materials |
Materials Engineering |
Quality Control, Reliability, Safety and Risk |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Nota di contenuto |
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Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die- |
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Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments. |
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Sommario/riassunto |
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This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field. |
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