LEADER 05093nam  22007575  450 
001 9910337937203321
005 20200630203452.0
010   $a3-319-99256-2
024 7 $a10.1007/978-3-319-99256-3
035   $a(CKB)4100000007592131
035   $a(DE-He213)978-3-319-99256-3
035   $a(MiAaPQ)EBC5702841
035   $a(PPN)233801618
035   $a(EXLCZ)994100000007592131
100   $a20190129d2019      u|         0
101 0 $aeng
135   $aurnn|008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aDie-Attach Materials for High Temperature Applications in Microelectronics Packaging $eMaterials, Processes, Equipment, and Reliability /$fedited by Kim S. Siow
205   $a1st ed. 2019.
210  1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2019.
215   $a1 online resource (XX, 279 p. 175 illus., 122 illus. in color.) 
311   $a3-319-99255-4 
327   $aChapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.
330   $aThis book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
606   $aOptical materials
606   $aElectronic materials
606   $aElectronics
606   $aMicroelectronics
606   $aMetals
606   $aMaterials science
606   $aEngineering?Materials
606   $aQuality control
606   $aReliability
606   $aIndustrial safety
606   $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000
606   $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027
606   $aMetallic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z16000
606   $aCharacterization and Evaluation of Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z17000
606   $aMaterials Engineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T28000
606   $aQuality Control, Reliability, Safety and Risk$3https://scigraph.springernature.com/ontologies/product-market-codes/T22032
615  0$aOptical materials.
615  0$aElectronic materials.
615  0$aElectronics.
615  0$aMicroelectronics.
615  0$aMetals.
615  0$aMaterials science.
615  0$aEngineering?Materials.
615  0$aQuality control.
615  0$aReliability.
615  0$aIndustrial safety.
615 14$aOptical and Electronic Materials.
615 24$aElectronics and Microelectronics, Instrumentation.
615 24$aMetallic Materials.
615 24$aCharacterization and Evaluation of Materials.
615 24$aMaterials Engineering.
615 24$aQuality Control, Reliability, Safety and Risk.
676   $a620.11295
676   $a620.11297
702   $aSiow$b Kim S$4edt$4http://id.loc.gov/vocabulary/relators/edt
906   $aBOOK
912   $a9910337937203321
996   $aDie-Attach Materials for High Temperature Applications in Microelectronics Packaging$91570050
997   $aUNINA