Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology / / by John H. Lau

• Autore: Lau John H
• Pubblicazione: Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2024
• Edizione: 1st ed. 2024.
• Descrizione fisica: 1 online resource (515 pages)
• Disciplina: 621,381
• Soggetto topico: Electronics; Solid state physics; Lasers; Optics; Electronics and Microelectronics, Instrumentation; Electronic Devices; Laser Technology; Optics and Photonics
• Nota di contenuto: -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics.
• Sommario/riassunto: This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
• Titolo autorizzato: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
• ISBN: 981-9721-40-7
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910864189803321
• Lo trovi qui: Univ. Federico II