LEADER 02744nam  22005895  450 
001 9910864189803321
005 20250807143421.0
010   $a981-9721-40-7
024 7 $a10.1007/978-981-97-2140-5
035   $a(MiAaPQ)EBC31352510
035   $a(Au-PeEL)EBL31352510
035   $a(CKB)32141995400041
035   $a(DE-He213)978-981-97-2140-5
035   $a(EXLCZ)9932141995400041
100   $a20240523d2024      u|         0
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology /$fby John H. Lau
205   $a1st ed. 2024.
210  1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2024.
215   $a1 online resource (515 pages)
311 08$a981-9721-39-3 
327   $a -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics.
330   $aThis book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
606   $aElectronics
606   $aSolid state physics
606   $aLasers
606   $aOptics
606   $aElectronics and Microelectronics, Instrumentation
606   $aElectronic Devices
606   $aLaser Technology
606   $aOptics and Photonics
615  0$aElectronics.
615  0$aSolid state physics.
615  0$aLasers.
615  0$aOptics.
615 14$aElectronics and Microelectronics, Instrumentation.
615 24$aElectronic Devices.
615 24$aLaser Technology.
615 24$aOptics and Photonics.
676   $a621,381
700   $aLau$b John H$0972648
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910864189803321
996   $aFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology$94166904
997   $aUNINA