02744nam 22005895 450 991086418980332120250807143421.0981-9721-40-710.1007/978-981-97-2140-5(MiAaPQ)EBC31352510(Au-PeEL)EBL31352510(CKB)32141995400041(DE-He213)978-981-97-2140-5(EXLCZ)993214199540004120240523d2024 u| 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology /by John H. Lau1st ed. 2024.Singapore :Springer Nature Singapore :Imprint: Springer,2024.1 online resource (515 pages)981-9721-39-3 -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics.This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.ElectronicsSolid state physicsLasersOpticsElectronics and Microelectronics, InstrumentationElectronic DevicesLaser TechnologyOptics and PhotonicsElectronics.Solid state physics.Lasers.Optics.Electronics and Microelectronics, Instrumentation.Electronic Devices.Laser Technology.Optics and Photonics.621,381Lau John H972648MiAaPQMiAaPQMiAaPQBOOK9910864189803321Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology4166904UNINA