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[null,"1.","Record Nr.",null,"UNISA996386269303316"]
[null,null,"Autore",null,"R. S"]
[null,null,"Titolo",null,"Avona, or, A transient view of the benefit of making rivers of this kingdom navigable [[electronic resource] ] : occasioned by observing the scituation of the city of Salisbury upon the Avon, and the consequence of opening that river to that city : communicated by letter to a friend at London / / by R.S"]
[null,null,"Pubbl/distr/stampa",null,"London, : Printed by T.R. & N.T. for John Courtney ..., 1675"]
[null,null,"Descrizione fisica",null,"[2], 33 p"]
[null,null,"Soggetti",null,"Rivers - England"]
[{"$nulls":4},"Avon, River (Leicestershire-Gloucestershire, England) Navigation"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Reproduction of original in Harvard University Libraries."]
[null,null,null,"Sommario/riassunto","eebo-0062"]
[null,"2.","Record Nr.",null,"UNINA9910864189803321"]
[null,null,"Autore",null,"Lau John H"]
[null,null,"Titolo",null,"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology / / by John H. Lau"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2024"]
[null,null,"ISBN",null,"981-9721-40-7"]
[null,null,"Edizione",null,"[1st ed. 2024.]"]
[null,null,"Descrizione fisica",null,"1 online resource (515 pages)"]
[null,null,"Disciplina",null,"621,381"]
[null,null,"Soggetti",null,"Electronics"]
[{"$nulls":4},"Solid state physics"]
[{"$nulls":4},"Lasers"]
[{"$nulls":4},"Optics"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[{"$nulls":4},"Electronic Devices"]
[{"$nulls":4},"Laser Technology"]
[{"$nulls":4},"Optics and Photonics"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"-- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics."]
[null,null,null,"Sommario/riassunto","This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc."]