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Biblioteca

MARC Lista (tabellare)
The chemistry of metal CVD / / edited by Toivo T. Kodas and Mark J. Hampden-Smith
The chemistry of metal CVD / / edited by Toivo T. Kodas and Mark J. Hampden-Smith
Pubbl/distr/stampa Weinheim, [Germany] : , : VCH, , 1994
Descrizione fisica 1 online resource (566 p.)
Disciplina 546.3
621.3815
Soggetto topico Electronic circuit design
Chemical vapor deposition
Metallic films
ISBN 1-281-84291-5
9786611842918
3-527-61585-7
3-527-61584-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto The Chemistry of Metal CVD; Contents; List of Contributors; Chemical Abbreviations; General Abbreviations; 1 Introduction; 1.1 Introduction; 1.2 Current Interconnect Schemes in Silicon Devices; 1.2.1 Metal-Silicon Contacts; 1.2.2 Diffusion Barrier Layers; 1.2.2.1 Sacrificial Diffusion Barriers; 1.2.2.2 Stuffed Diffusion Barriers; 1.2.2.3 Passive Diffusion Barriers; 1.2.2.4 Amorphous Diffusion Barriers; 1.2.3 Contact Layers; 1.2.3.1 Platinum Silicide (PtSi); 1.2.3.2 Titanium Silicide (TiSi2); 1.2.3.3 Cobalt Silicide (CoSi2); 1.2.3.4 Other Near Noble Silicides (Nisi, PdzSi, MoSi2)
1.2.4 Primary Interconnection1.2.4.1 Aluminum Metallization; 1.2.4.2 Tungsten Metallization; 1.2.4.3 Copper Metallization; 1.2.4.4 Gold Metallization; 1.3 Metallization Requirements for the Year 2001 in Silicon-Based Technologies; 1.3.1 Trends in Device and Process Architecture; 1.3.2 CVD of Titanium; 1.3.3 CVD of Metal Silicides; 1.3.4 CVD of Metal Nitrides; 1.3.5 CVD of Copper and Barrier Layers; 1.3.6 Other Metallizations; 1.4 Metal Deposition Techniques; 1.4.1 Physical Vapor Deposition by Evaporation; 1.4.2 Physical Vapor Deposition by Sputtering
1.4.2.1 Conventional Sputter Deposition Techniques1.4.2.2 Magnetron-Based Sputter Deposition; 1.4.3 Chemical Vapor Deposition; 1.5 Manufacturing Issues in CVD Processes; 1.6 Summary and Conclusions; Acknowledgments; References; 2 Chemical Vapor Deposition of Aluminum; 2.1 Applications of Aluminum Films; 2.1.1 Microelectronics; 2.1.2 Metallized Polymers; 2.1.2.1 Gas Diffusion Barriers; 2.1.2.2 Optical Properties; 2.1.3 Adhesion; 2.2 Comparison Between Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) of Aluminum; 2.3 Understanding the CVD Process; 2.3.1 Surface Diffusion
2.3.2 Transport Phenomena2.3.3 Gas-Phase Reactions; 2.3.4 Surface Reactivity; 2.3.5 Nucleation; 2.3.6 Summary of Aluminum Precursors; 2.4 CVD Using Triisobutylaluminum; 2.4.1 Early Developments; 2.4.2 Optimization of Aluminum CVD; 2.4.2.1 Morphology of Aluminum Deposits; 2.4.2.2 Alloys with Cu and Si; 2.4.2.3 Nucleation Promoters; 2.4.2.4 Aluminum Epitaxy on Si; 2.4.3 Surface Decomposition Mechanism of TIBA; 2.4.4 Patterning of Aluminum Films; 2.5 Deposition of Aluminum from Trimethylaluminum; 2.5.1 Thermal Activation of TMA; 2.5.2 Plasma-Assisted Aluminum Deposition Using TMA
2.5.3 Laser-Assisted Aluminum Deposition from TMA2.6 Deposition of Aluminum Films from Alane Precursors; 2.6.1 Surface Reaction Mechanism of TMAA; 2.6.2 Deposition in Cold-Wall Reactors Using TMAA; 2.6.3 Deposition in Hot-Wall Reactors Using TMAA; 2.6.4 Aluminum Deposition from TEAA; 2.6.5 Aluminum Deposition from DMEAA; 2.6.6 Selectivity of Deposition Using Alane Precursors; 2.6.7 Aluminum Deposition Using Aluminaborane Precursors; 2.6.8 Gas-Phase Aluminum Particle Formation From Amine Alanes; 2.7 Alternative Aluminum Alkyl Sources; 2.7.1 Triethylaluminum; 2.7.2 Dimethylaluminum Hydride
2.7.3 Diethylaluminum Chloride
Record Nr. UNISA-996199395603316
Weinheim, [Germany] : , : VCH, , 1994
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
The chemistry of metal CVD / / edited by Toivo T. Kodas and Mark J. Hampden-Smith
The chemistry of metal CVD / / edited by Toivo T. Kodas and Mark J. Hampden-Smith
Pubbl/distr/stampa Weinheim, [Germany] : , : VCH, , 1994
Descrizione fisica 1 online resource (566 p.)
Disciplina 546.3
621.3815
Soggetto topico Electronic circuit design
Chemical vapor deposition
Metallic films
ISBN 1-281-84291-5
9786611842918
3-527-61585-7
3-527-61584-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto The Chemistry of Metal CVD; Contents; List of Contributors; Chemical Abbreviations; General Abbreviations; 1 Introduction; 1.1 Introduction; 1.2 Current Interconnect Schemes in Silicon Devices; 1.2.1 Metal-Silicon Contacts; 1.2.2 Diffusion Barrier Layers; 1.2.2.1 Sacrificial Diffusion Barriers; 1.2.2.2 Stuffed Diffusion Barriers; 1.2.2.3 Passive Diffusion Barriers; 1.2.2.4 Amorphous Diffusion Barriers; 1.2.3 Contact Layers; 1.2.3.1 Platinum Silicide (PtSi); 1.2.3.2 Titanium Silicide (TiSi2); 1.2.3.3 Cobalt Silicide (CoSi2); 1.2.3.4 Other Near Noble Silicides (Nisi, PdzSi, MoSi2)
1.2.4 Primary Interconnection1.2.4.1 Aluminum Metallization; 1.2.4.2 Tungsten Metallization; 1.2.4.3 Copper Metallization; 1.2.4.4 Gold Metallization; 1.3 Metallization Requirements for the Year 2001 in Silicon-Based Technologies; 1.3.1 Trends in Device and Process Architecture; 1.3.2 CVD of Titanium; 1.3.3 CVD of Metal Silicides; 1.3.4 CVD of Metal Nitrides; 1.3.5 CVD of Copper and Barrier Layers; 1.3.6 Other Metallizations; 1.4 Metal Deposition Techniques; 1.4.1 Physical Vapor Deposition by Evaporation; 1.4.2 Physical Vapor Deposition by Sputtering
1.4.2.1 Conventional Sputter Deposition Techniques1.4.2.2 Magnetron-Based Sputter Deposition; 1.4.3 Chemical Vapor Deposition; 1.5 Manufacturing Issues in CVD Processes; 1.6 Summary and Conclusions; Acknowledgments; References; 2 Chemical Vapor Deposition of Aluminum; 2.1 Applications of Aluminum Films; 2.1.1 Microelectronics; 2.1.2 Metallized Polymers; 2.1.2.1 Gas Diffusion Barriers; 2.1.2.2 Optical Properties; 2.1.3 Adhesion; 2.2 Comparison Between Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) of Aluminum; 2.3 Understanding the CVD Process; 2.3.1 Surface Diffusion
2.3.2 Transport Phenomena2.3.3 Gas-Phase Reactions; 2.3.4 Surface Reactivity; 2.3.5 Nucleation; 2.3.6 Summary of Aluminum Precursors; 2.4 CVD Using Triisobutylaluminum; 2.4.1 Early Developments; 2.4.2 Optimization of Aluminum CVD; 2.4.2.1 Morphology of Aluminum Deposits; 2.4.2.2 Alloys with Cu and Si; 2.4.2.3 Nucleation Promoters; 2.4.2.4 Aluminum Epitaxy on Si; 2.4.3 Surface Decomposition Mechanism of TIBA; 2.4.4 Patterning of Aluminum Films; 2.5 Deposition of Aluminum from Trimethylaluminum; 2.5.1 Thermal Activation of TMA; 2.5.2 Plasma-Assisted Aluminum Deposition Using TMA
2.5.3 Laser-Assisted Aluminum Deposition from TMA2.6 Deposition of Aluminum Films from Alane Precursors; 2.6.1 Surface Reaction Mechanism of TMAA; 2.6.2 Deposition in Cold-Wall Reactors Using TMAA; 2.6.3 Deposition in Hot-Wall Reactors Using TMAA; 2.6.4 Aluminum Deposition from TEAA; 2.6.5 Aluminum Deposition from DMEAA; 2.6.6 Selectivity of Deposition Using Alane Precursors; 2.6.7 Aluminum Deposition Using Aluminaborane Precursors; 2.6.8 Gas-Phase Aluminum Particle Formation From Amine Alanes; 2.7 Alternative Aluminum Alkyl Sources; 2.7.1 Triethylaluminum; 2.7.2 Dimethylaluminum Hydride
2.7.3 Diethylaluminum Chloride
Record Nr. UNINA-9910830567303321
Weinheim, [Germany] : , : VCH, , 1994
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Circuit design : anticipate, analyze, exploit variations / / Stephan Weber, Candido Duarte
Circuit design : anticipate, analyze, exploit variations / / Stephan Weber, Candido Duarte
Autore Weber Stephan
Edizione [1st ed.]
Pubbl/distr/stampa Taylor & Francis, 2017
Descrizione fisica 1 online resource (640 pages) : illustrations, tables
Disciplina 621.3815
Collana River Publishers Series in Circuits and Systems
Soggetto topico Electronic circuit design
Soggetto non controllato Energy
ISBN 1-00-333753-8
1-003-33753-8
1-000-79409-1
87-93379-76-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910632998703321
Weber Stephan  
Taylor & Francis, 2017
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Circuit Design and Simulation Quick Start Guide [[electronic resource] ] : Create Schematics and Layout Electronic Components / / by Ashraf Said Ahmad AlMadhoun
Circuit Design and Simulation Quick Start Guide [[electronic resource] ] : Create Schematics and Layout Electronic Components / / by Ashraf Said Ahmad AlMadhoun
Autore AlMadhoun Ashraf Said Ahmad
Edizione [1st ed. 2023.]
Pubbl/distr/stampa Berkeley, CA : , : Apress : , : Imprint : Apress, , 2023
Descrizione fisica 1 online resource (190 pages)
Disciplina 004
Collana Maker Innovations Series
Soggetto topico Electronic circuit design
ISBN 1-4842-9582-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Chapter 1: Microcontroller -- Chapter 2: Basics -- Chapter 3: Explaining the Interface and Simulating Your First Circuit -- Chapter 4: Breadboard and RGB LEDs -- Chapter 5: Ohm's Law -- Chapter 6: Series and Parallel Circuits -- Chapter 7: Arduino Output Basics -- Chapter 8: Arduino Input Basics -- Chapter 9: Dealing with RGB LEDs + Potentiometers -- Chapter 10: Arduino Serial Monitoring.
Record Nr. UNINA-9910760248803321
AlMadhoun Ashraf Said Ahmad  
Berkeley, CA : , : Apress : , : Imprint : Apress, , 2023
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Circuit design with VHDL [[electronic resource] /] / Volnei A. Pedroni
Circuit design with VHDL [[electronic resource] /] / Volnei A. Pedroni
Autore Pedroni Volnei A
Pubbl/distr/stampa Cambridge, Mass., : MIT Press, c2004
Descrizione fisica xii, 363 p. : ill
Disciplina 621.39/5
Soggetto topico VHDL (Computer hardware description language)
Electronic circuit design
System design
ISBN 1-282-09667-2
0-262-25678-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910260635803321
Pedroni Volnei A  
Cambridge, Mass., : MIT Press, c2004
Materiale a stampa
Lo trovi qui: Univ. Federico II
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The Circuit Designer's Companion [[electronic resource]]
The Circuit Designer's Companion [[electronic resource]]
Autore Williams Tim
Edizione [2nd ed.]
Descrizione fisica 1 online resource (354 p.)
Disciplina 621.3815
Soggetto topico Electronic circuit design
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Soggetto genere / forma Electronic books.
ISBN 1-281-00939-3
9786611009397
0-08-047651-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; The Circuit Designer's Companion; Contents; Introduction; Introduction to the second edition; Chapter 1 Grounding and wiring; 1.1 Grounding; When to consider grounding; 1.1.1 Grounding within one unit; 1.1.2 Chassis ground; 1.1.3 The conductivity of aluminium; Other materials; 1.1.4 Ground loops; 1.1.5 Power supply returns; Varying loads; Power rail feed; Conductor impedance; 1.1.6 Input signal ground; Connection to 0V elsewhere on the pcb; Connection to 0V within the unit; External ground connection; 1.1.7 Output signal ground; Avoiding the common impedance
1.1.8 Inter-board interface signalsPartitioning the signal return; 1.1.9 Star-point grounding; 1.1.10 Ground connections between units; Breaking the ground link; 1.1.11 Shielding; Which end to ground for LF shielding; Electrostatic screening; Surface transfer impedance; 1.1.12 The safety earth; 1.2 Wiring and cables; 1.2.1 Wire types; Wire inductance; Equipment wire; 1.2.2 Cable types; 1.2.3 Power cables; 1.2.4 Data and multicore cables; Data communication cables; Structured data cable; Shielding and microphony; 1.2.5 RF cables; 1.2.6 Twisted pair; 1.2.7 Crosstalk; Digital crosstalk
1.3 Transmission linesTransmission line effects; Critical lengths for pulses; 1.3.1 Characteristic impedance; 1.3.2 Time domain; Forward and reflected waves; Ringing; The Bergeron diagram; The uses of mismatching; 1.3.3 Frequency domain; Standing wave distribution vs. frequency; Impedance transformation; Lossy lines; Chapter 2 Printed circuits; 2.1 Board types; 2.1.1 Materials; Epoxy-glass; 2.1.2 Type of construction; 2.1.3 Choice of type; 2.1.4 Choice of size; Sub-division boundaries; Panelisation; 2.1.5 How a multilayer board is made; 2.2 Design rules; 2.2.1 Track width and spacing
Conductor resistanceVoltage breakdown and crosstalk; Constant impedance; 2.2.2 Hole and pad size; Vias; Through hole pads; Surface mount pads; 2.2.3 Track routing; 2.2.4 Ground and power distribution; Ground rail inductance; Gridded ground layout; The ground plane; Inside or outside layers; Multiple ground planes; 2.2.5 Copper plating and finishing; 2.2.6 Solder resist; Screen printed resists; Photo-imaged film; 2.2.7 Terminations and connections; Two-part connectors; Edge connectors; 2.3 Board assembly: surface mount and through hole; 2.3.1 Surface mount design rules; Solder process
Printed circuit board qualityThermal stresses; Cleaning and testing; 2.3.2 Package placement; 2.3.3 Component identification; Polarity indication; 2.4 Surface protection; Variations in surface resistance; Circuit design vs. surface resistance; 2.4.1 Guarding; 2.4.2 Conformal coating; Coating vs. encapsulation; Steps to take before coating; Application; Test and rework; 2.5 Sourcing boards and artwork; 2.5.1 Artwork; Using a bureau; Disadvantages of a bureau; 2.5.2 Boards; Chapter 3 Passive components; 3.1 Resistors; 3.1.1 Resistor types; Surface mount chip; Metal film; Carbon; Wirewound
Precision resistors
Record Nr. UNINA-9910457686203321
Williams Tim  
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
The Circuit Designer's Companion [[electronic resource]]
The Circuit Designer's Companion [[electronic resource]]
Autore Williams Tim
Edizione [2nd ed.]
Descrizione fisica 1 online resource (354 p.)
Disciplina 621.3815
Soggetto topico Electronic circuit design
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 1-281-00939-3
9786611009397
0-08-047651-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; The Circuit Designer's Companion; Contents; Introduction; Introduction to the second edition; Chapter 1 Grounding and wiring; 1.1 Grounding; When to consider grounding; 1.1.1 Grounding within one unit; 1.1.2 Chassis ground; 1.1.3 The conductivity of aluminium; Other materials; 1.1.4 Ground loops; 1.1.5 Power supply returns; Varying loads; Power rail feed; Conductor impedance; 1.1.6 Input signal ground; Connection to 0V elsewhere on the pcb; Connection to 0V within the unit; External ground connection; 1.1.7 Output signal ground; Avoiding the common impedance
1.1.8 Inter-board interface signalsPartitioning the signal return; 1.1.9 Star-point grounding; 1.1.10 Ground connections between units; Breaking the ground link; 1.1.11 Shielding; Which end to ground for LF shielding; Electrostatic screening; Surface transfer impedance; 1.1.12 The safety earth; 1.2 Wiring and cables; 1.2.1 Wire types; Wire inductance; Equipment wire; 1.2.2 Cable types; 1.2.3 Power cables; 1.2.4 Data and multicore cables; Data communication cables; Structured data cable; Shielding and microphony; 1.2.5 RF cables; 1.2.6 Twisted pair; 1.2.7 Crosstalk; Digital crosstalk
1.3 Transmission linesTransmission line effects; Critical lengths for pulses; 1.3.1 Characteristic impedance; 1.3.2 Time domain; Forward and reflected waves; Ringing; The Bergeron diagram; The uses of mismatching; 1.3.3 Frequency domain; Standing wave distribution vs. frequency; Impedance transformation; Lossy lines; Chapter 2 Printed circuits; 2.1 Board types; 2.1.1 Materials; Epoxy-glass; 2.1.2 Type of construction; 2.1.3 Choice of type; 2.1.4 Choice of size; Sub-division boundaries; Panelisation; 2.1.5 How a multilayer board is made; 2.2 Design rules; 2.2.1 Track width and spacing
Conductor resistanceVoltage breakdown and crosstalk; Constant impedance; 2.2.2 Hole and pad size; Vias; Through hole pads; Surface mount pads; 2.2.3 Track routing; 2.2.4 Ground and power distribution; Ground rail inductance; Gridded ground layout; The ground plane; Inside or outside layers; Multiple ground planes; 2.2.5 Copper plating and finishing; 2.2.6 Solder resist; Screen printed resists; Photo-imaged film; 2.2.7 Terminations and connections; Two-part connectors; Edge connectors; 2.3 Board assembly: surface mount and through hole; 2.3.1 Surface mount design rules; Solder process
Printed circuit board qualityThermal stresses; Cleaning and testing; 2.3.2 Package placement; 2.3.3 Component identification; Polarity indication; 2.4 Surface protection; Variations in surface resistance; Circuit design vs. surface resistance; 2.4.1 Guarding; 2.4.2 Conformal coating; Coating vs. encapsulation; Steps to take before coating; Application; Test and rework; 2.5 Sourcing boards and artwork; 2.5.1 Artwork; Using a bureau; Disadvantages of a bureau; 2.5.2 Boards; Chapter 3 Passive components; 3.1 Resistors; 3.1.1 Resistor types; Surface mount chip; Metal film; Carbon; Wirewound
Precision resistors
Record Nr. UNINA-9910784446003321
Williams Tim  
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
The Circuit Designer's Companion [[electronic resource]]
The Circuit Designer's Companion [[electronic resource]]
Autore Williams Tim
Edizione [2nd ed.]
Descrizione fisica 1 online resource (354 p.)
Disciplina 621.3815
Soggetto topico Electronic circuit design
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 1-281-00939-3
9786611009397
0-08-047651-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; The Circuit Designer's Companion; Contents; Introduction; Introduction to the second edition; Chapter 1 Grounding and wiring; 1.1 Grounding; When to consider grounding; 1.1.1 Grounding within one unit; 1.1.2 Chassis ground; 1.1.3 The conductivity of aluminium; Other materials; 1.1.4 Ground loops; 1.1.5 Power supply returns; Varying loads; Power rail feed; Conductor impedance; 1.1.6 Input signal ground; Connection to 0V elsewhere on the pcb; Connection to 0V within the unit; External ground connection; 1.1.7 Output signal ground; Avoiding the common impedance
1.1.8 Inter-board interface signalsPartitioning the signal return; 1.1.9 Star-point grounding; 1.1.10 Ground connections between units; Breaking the ground link; 1.1.11 Shielding; Which end to ground for LF shielding; Electrostatic screening; Surface transfer impedance; 1.1.12 The safety earth; 1.2 Wiring and cables; 1.2.1 Wire types; Wire inductance; Equipment wire; 1.2.2 Cable types; 1.2.3 Power cables; 1.2.4 Data and multicore cables; Data communication cables; Structured data cable; Shielding and microphony; 1.2.5 RF cables; 1.2.6 Twisted pair; 1.2.7 Crosstalk; Digital crosstalk
1.3 Transmission linesTransmission line effects; Critical lengths for pulses; 1.3.1 Characteristic impedance; 1.3.2 Time domain; Forward and reflected waves; Ringing; The Bergeron diagram; The uses of mismatching; 1.3.3 Frequency domain; Standing wave distribution vs. frequency; Impedance transformation; Lossy lines; Chapter 2 Printed circuits; 2.1 Board types; 2.1.1 Materials; Epoxy-glass; 2.1.2 Type of construction; 2.1.3 Choice of type; 2.1.4 Choice of size; Sub-division boundaries; Panelisation; 2.1.5 How a multilayer board is made; 2.2 Design rules; 2.2.1 Track width and spacing
Conductor resistanceVoltage breakdown and crosstalk; Constant impedance; 2.2.2 Hole and pad size; Vias; Through hole pads; Surface mount pads; 2.2.3 Track routing; 2.2.4 Ground and power distribution; Ground rail inductance; Gridded ground layout; The ground plane; Inside or outside layers; Multiple ground planes; 2.2.5 Copper plating and finishing; 2.2.6 Solder resist; Screen printed resists; Photo-imaged film; 2.2.7 Terminations and connections; Two-part connectors; Edge connectors; 2.3 Board assembly: surface mount and through hole; 2.3.1 Surface mount design rules; Solder process
Printed circuit board qualityThermal stresses; Cleaning and testing; 2.3.2 Package placement; 2.3.3 Component identification; Polarity indication; 2.4 Surface protection; Variations in surface resistance; Circuit design vs. surface resistance; 2.4.1 Guarding; 2.4.2 Conformal coating; Coating vs. encapsulation; Steps to take before coating; Application; Test and rework; 2.5 Sourcing boards and artwork; 2.5.1 Artwork; Using a bureau; Disadvantages of a bureau; 2.5.2 Boards; Chapter 3 Passive components; 3.1 Resistors; 3.1.1 Resistor types; Surface mount chip; Metal film; Carbon; Wirewound
Precision resistors
Record Nr. UNINA-9910815967603321
Williams Tim  
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
The Circuit designer's companion / / Peter Wilson
The Circuit designer's companion / / Peter Wilson
Autore Wilson Peter
Edizione [Fourth edition.]
Pubbl/distr/stampa Oxford, England ; ; Cambridge, Massachusetts : , : Newnes, , 2017
Descrizione fisica 1 online resource (1 volume) : illustrations
Disciplina 21.3815
Soggetto topico Electronic circuit design
ISBN 0-08-101765-0
0-08-101764-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910583360303321
Wilson Peter  
Oxford, England ; ; Cambridge, Massachusetts : , : Newnes, , 2017
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
CMOS data converters for communications [[electronic resource] /] / by Mikael Gustavsson, J. Jacob Wikner, and Nianxiong Nick Tan
CMOS data converters for communications [[electronic resource] /] / by Mikael Gustavsson, J. Jacob Wikner, and Nianxiong Nick Tan
Autore Gustavsson Mikael
Edizione [1st ed. 2002.]
Pubbl/distr/stampa Boston, : Kluwer Academic, c2000
Descrizione fisica 1 online resource (401 p.)
Disciplina 621.39/732
Altri autori (Persone) WiknerJ. Jacob
TanNianxiong <1966->
Collana The Kluwer international series in engineering and computer science
Soggetto topico Analog-to-digital converters - Design and construction
Digital-to-analog converters - Design and construction
Metal oxide semiconductors, Complementary
Electronic circuit design
Soggetto genere / forma Electronic books.
ISBN 1-280-20789-2
9786610207893
0-306-47305-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Characterization of Data Converters -- Data Converter Requirements for Communications -- Overview of High-Speed A/D Converter Architectures -- Overview of D/A Converter Architectures -- Overview of Circuit Techniques -- Analog Functional Blocks -- Basic Analog Circuit Design -- Low-Voltage Analog Techniques -- Pipelined A/D Converters -- Time-Interleaved A/D Converters -- Oversampling A/D Converters -- Modeling of Nyquist D/A Converters -- Implementation of CMOS Current-Steering D/A Converters.
Record Nr. UNINA-9910454851503321
Gustavsson Mikael  
Boston, : Kluwer Academic, c2000
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui